Apparatus and methods for detecting overlay errors using scatterometry

• US 7,663,753 B2
• Filed: 12/21/2007
• Issued: 02/16/2010
• Est. Priority Date: 12/05/2002
• Status: Active Grant

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Adel, Michael, Ghinovker, Mark, Golovanevsky, Boris, Gross, Ken, Fabrikant, Anatoly, Levy, Ady, Wack, Dan, Friedmann, Michael, Smith, Ian, Mieher, Walter D., Fielden, John, Bareket, Noah, Bevis, Christopher F., Dziura, Thaddeus G., Zalicki, Piotr, Dececco, Paola
• Primary Examiner(s): Chowdhury; Tarifur
• Assistant Examiner(s): Stock, Jr.; Gordon J
• Application Number:
  US11/963,730
• Publication Number:
  US 20080094630A1
• Time in Patent Office: 788 Days
• Field of Search: None
• US Class Current: 356/401
• CPC Class Codes: G01N 2021/213 Spectrometric ellipsometry
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: G03F 7/70683 Mark designs
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric
• CPC Class Codes: G03F 9/7084 Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. Target A is designed to have an offset Xa between its first and second structures portions; target B is designed to have an offset Xb; target C is designed to have an offset Xc; and target D is designed to have an offset Xd. Each of the offsets Xa, Xb, Xc and Xd is preferably different from zero; Xa is an opposite sign and differ from Xb; and Xc is an opposite sign and differs from Xd. The targets A, B, C and D are illuminated with electromagnetic radiation to obtain spectra S_A, S_B, S_C, and S_D from targets A, B, C, and D, respectively. Any overlay error between the first structures and the second structures is then determined using a linear approximation based on the obtained spectra S_A, S_B, S_C, and S_D.

Claims

1. A method for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample, the method comprising:

providing a plurality of targets that each include a portion of the first and second structures and each is designed to have an offset between its first and second structure portions;

illuminating the targets with electromagnetic radiation to obtain spectra for each target, wherein obtaining the spectra comprises acquiring radiation from the targets at a selected one or more wavelengths using an imaging system with wavelength selection and acquiring an image from each of the targets, wherein the spectra are an averaged or summed one or more intensity value(s) of one or more pixels of the corresponding target image;

selecting a wavelength using the imaging system such that contrast between the spectra is maximized; and

determining any overlay error between the first structures and the second structures using a scatterometry technique based on the obtained spectra for each target.

2. The method of claim 1, wherein the imaging spectrometer is an interferometric imaging system, wherein one or more wavelengths are selected by controlling one or more optical paths in the interferometric imaging system.

3. The method of claim 1, wherein the imaging system is a Michelson interferometer.

4. The method of claim 1, wherein the imaging system is a Mach-Zehnder interferometer.

5. The method of claim 1, wherein the imaging system is a Sagnac interferometer.

6. The method of claim 1, wherein the illuminating the targets with electromagnetic radiation takes place substantially at different times such that the corresponding spectra are obtained at substantially different times.

7. The method of claim 1, wherein the illuminating the targets with electromagnetic radiation takes place substantially simultaneously such that the corresponding spectra are produced substantially simultaneously.

8. The method of claim 1, wherein the illuminating the targets with electromagnetic radiation takes place substantially simultaneously for at least two of the targets.

9. The method of claim 1, wherein obtaining the spectra comprises acquiring radiation from the targets at a selected one or more polarization states and wherein any overlay is determined based on separating out polar components of the obtained spectra.

10. The method of claim 1, wherein any overlay error is based on deriving spectral information from the obtained spectra with a transform analysis.

11. The method of claim 1, wherein a numerical aperture (NA) of the scatterometry module is selected to ensure that only the −

1^st and +1^st orders −

/+1^st diffraction orders are obtained for the spectra.

12. The method of claim 1, wherein one or more wavelengths are selected so as to pass one or more particular colors for the spectra.

13. The method of claim 1, wherein any overlay is determined over multiple wavelength ranges.

14. The method of claim 1, wherein the imaging system includes a wavelength filter.

15. The method of claim 1, wherein the images of the targets are further analyzed to detect other types of processing problems, in addition to overlay error.

16. The method of claim 14, wherein the wavelength filter is a long-pass wavelength filter.

17. The method of claim 14, wherein the wavelength filter is a short-pass wavelength filter.

18. The method of claim 15, wherein obtaining the spectra comprises acquiring an image from the targets and wherein the other types of processing problems include determining whether an incorrect reticle has been used for one or more processing steps based on the images being materially different.

19. The method of claim 15, wherein the other types of processing problems include determining whether resist thickness was incorrect based on a brightness or contrast of the images.

20. The method of claim 15, wherein obtaining the wherein the other types of processing problems include determining whether resist streaking is present based on a variation of brightness or contrast over the images.

21. The method of claim 15, wherein the other types of processing problems include determining whether a CMP (chemical mechanical polishing) processing error has occurred based on an appearance of the images.

22. A method for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample, the method comprising:

providing targets A, B, C and D that each include a portion of the first and second structures,

wherein the target A is designed to have an offset Xa between its first and second structures portions,

wherein the target B is designed to have an offset Xb between its first and second structures portions,

wherein the target C is designed to have an offset Xc between its first and second structures portions,

wherein the target D is designed to have an offset Xd between its first and second structures portions,

wherein each of the offsets Xa, Xb, Xc and Xd is different from zero, Xa is an opposite sign and differ from Xb, and Xc is an opposite sign and differs from Xd;

illuminating the targets A, B, C and D with electromagnetic radiation to obtain spectra S_A, S_B, S_C, and S_D from targets A, B, C, and D, respectively; and

determining any overlay error between the first structures and the second structures using a linear approximation based on the obtained spectra S_A, S_B, S_C, and S_D,

wherein obtaining the spectra S_A, S_B, S_C, and S_D comprises acquiring radiation from the targets A, B, C, and D at a selected one or more wavelengths using an imaging system with wavelength selection,

wherein obtaining the spectra S_A, S_B, S_C, and S_D comprises acquiring an image from the targets A, B, C, and D and wherein the spectra S_A, S_B, S_C, and S_D are an averaged or summed one or more intensity value(s) of one or more pixels of the corresponding target image, the method further comprising selecting a wavelength using the imaging system such that contrast between the S_A, S_B, S_C, and S_D is maximized.

23. The method of claim 22, further comprising analyzing the images of the targets to detect defects in the sample.

24. A system for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample, comprising:

a scatterometry module for illuminating a plurality of targets, which each include a portion of the first and second structures and each is designed to have an offset between its first and second structure portions, with electromagnetic radiation to obtain spectra from the targets, wherein the scatterometry module includes wavelength selection; and

a processor operable for;

with the scatterometry module, illuminating the targets with electromagnetic radiation to obtain spectra for each target, wherein obtaining the spectra comprises acquiring radiation from the targets at a selected one or more wavelengths so as to acquire an image from each of the targets, wherein the spectra are an averaged or summed one or more intensity value(s) of one or more pixels of the corresponding target image,

selecting a wavelength using the wavelength selection of the scatterometry module such that contrast between the spectra is maximized, and

determining any overlay error between the first structures and the second structures using a scatterometry technique based on the obtained spectra each target.

25. The system of claim 24, wherein the scatterometry module is an interferometric imaging system, wherein the processor is operable for selecting one or more wavelengths for the wavelength selection device by controlling one or more optical paths in the interferometric imaging system.

26. The system of claim 24, wherein the illuminating the targets with electromagnetic radiation takes place substantially at different times such that the corresponding spectra are obtained at substantially different times.

27. The system of claim 24, wherein the illuminating the targets with electromagnetic radiation takes place substantially simultaneously such that the corresponding spectra are produced substantially simultaneously.

28. The system of claim 24, wherein the illuminating the targets with electromagnetic radiation takes place substantially simultaneously for at least two of the targets.

29. The system of claim 24, wherein the scatterometry module is operable to acquire the radiation at simultaneous, multiple angles of illumination.

30. The system of claim 24, wherein the processor is further operable for focusing the scatterometry module only for illuminating a one of the targets and not refocusing the scatterometry module for illuminating the other of the targets.

31. The system of claim 24, wherein the scatterometry module is an imaging spectroscopic reflectometer or a polarized spectroscopic imaging reflectometer.

32. The system of claim 24, wherein the scatterometry module is operable to use spectral imaging based on LED illumination.

33. The system of claim 24, wherein the scatterometry module is a Fourier transform imaging spectrometer.

34. The system of claim 24, wherein the scatterometry module includes a two-dimension detector having one detector axis positioned to collect spatial information from the different targets and another detector axis positioned to collect spectrally resolved information from light spectroscopically separated with a prism system or a diffraction grating system.

35. The system of claim 24, wherein the scatterometry module includes a plurality of separate detection systems to separately or simultaneously record one or more of the following light signals:

unpolarized reflected light, polarized light with an electric field substantially parallel to one major symmetry axis of one layer of the targets, polarized light with an electric field substantially perpendicular to one major symmetry axis of one layer of the targets, polarized light with an electric field at an angle to one major symmetry axis of one layer of the targets and/or right-hand circularly polarized radiation, left-hand circularly polarized radiation.

36. The of claim 24, wherein the processor is further operable for selecting an illumination and imaging NA'"'"'s of the scatterometry module to optimize the performance of the imaging system by ensuring that only the −

1^st and +1^st diffraction orders are collected.

37. The system of claim 24, wherein the scatterometry module includes a wavelength filter.

38. The system of claim 24, wherein the targets are arranged in a linear array and wherein the scatterometry module includes a two-dimension detector with one detector axis positioned to detect signals from the different targets and another detector axis positioned to detect spectral information.

39. The imaging system of claim 36, wherein the scatterometry module is an imaging spectroscopic ellipsometer.

40. The system of claim 37, wherein the wavelength filter is a long-pass wavelength filter.

41. The system of claim 37, wherein the wavelength filter is a short-pass wavelength filter.

42. The system of claim 38, wherein the scatterometry module is operable to image a linear or cylindrical image of the linear away of targets onto a prism or a grating system.

43. The system of claim 38, wherein the scatterometry module contain a lenslet array operable to separate and direct reflected or scattered light from different targets or different target sections.

44. An imaging system for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample, comprising:

a scatterometry module for illuminating the targets A, B, C and D with electromagnetic radiation to obtain spectra S_A, S_B, S_C, and S_D from targets A, B, C, and D, respectively; and

a processor operable for determining any overlay error between the first structures and the second structures using a linear approximation based on the obtained spectra S_A, S_B, S_C, and S_D,

wherein targets A, B, C and D each include a portion of the first and second structures,

wherein the target A is designed to have an offset Xa between its first and second structures portions,

wherein the target B is designed to have an offset Xb between its first and second structures portions,

wherein the target C is designed to have an offset Xc between its first and second structures portions,

wherein the target D is designed to have an offset Xd between its first and second structures portions, and

wherein each of the offsets Xa, Xb, Xc and Xd is different from zero, Xa is an opposite sign and differ from Xb, and Xc is an opposite sign and differs from Xd,

wherein obtaining the spectra S_A, S_B, S_C, and S_D comprises acquiring radiation from the targets A, B, C, and D at a selected one or more wavelengths,

wherein obtaining the spectra S_A, S_B, S_C, and S_D comprises acquiring an image from the targets A, B, C, and D and wherein the spectra S_A, S_B, S_C, and S_D are an averaged or summed one or more intensity value(s) of one or more pixels of the corresponding target image, the method further comprising selecting a wavelength using the imaging system such that contrast between the S_A, S_B, S_C, and S_D is maximized.

45. The imaging system of claim 44, wherein the processor is further operable for analyzing the images of the targets to detect defects in the sample.