Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof

• US 7,666,715 B2
• Filed: 12/14/2004
• Issued: 02/23/2010
• Est. Priority Date: 12/30/2003
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Jager, Harald, Brunner, Herbert, Sorg, Jorg Erich
• Primary Examiner(s): Tran; Minh-Loan T
• Assistant Examiner(s): KUO, WENSING W
• Application Number:
  US10/578,854
• Publication Number:
  US 20070131957A1
• Time in Patent Office: 1,897 Days
• Field of Search: 257/100, 257/E23.12, 257/E23.121, 438/124, 438/126, 438/127
• US Class Current: 438/124
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

Claims

1. A method of making multiple radiation-emitting and/or radiation receiving semiconductor components each comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic body which is transmissive to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip, wherein

the semiconductor chip of each component is attached to a metallic lead frame, a carrier substrate or a flexible lead frame comprising the external electrical leads,

the semiconductor chip of each component, including subregions of the lead frame, the carrier substrate or the flexible lead frame, is placed in a respective cavity of an injection mold, and an injection channel is led through each of the multiple semiconductor components,

silicone molding compound is injected into the respective cavities through the injection channel via an injection molding process or a transfer molding process, and

the silicone molding compound is cured in the respective cavities at least such that in each cavity, a shape-stable molded plastic part is formed.

2. The method as in claim 1, wherein the silicone molding compound has a curing time of 10 minutes or less.

3. The method as in claim 1, wherein the semiconductor chip is attached to a flexible lead frame formed by a carrier film.

4. The method as in claim 3, further comprising forming the carrier film, wherein forming the carrier film comprises forming a laminate comprising a plastic film and a metal film.

5. The method as in claim 4, wherein forming the carrier film further comprises stamping the metal film to define a cathode and an anode for the semiconductor chip.

6. The method as in claim 5, wherein forming the carrier film further comprises stamping openings into the plastic film.

7. The method as in claim 5, wherein forming the carrier film further comprises stamping openings in the plastic film, the openings being arranged over the cathode and the anode.

8. The method as in claim 7, wherein the semiconductor chip is bonded to the cathode through one of the openings.