Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

• US 7,675,166 B2
• Filed: 05/11/2005
• Issued: 03/09/2010
• Est. Priority Date: 05/11/2005
• Status: Active Grant

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Jones, Scott, Gordon, Jeff Alan, Kurkowski, Hal, Hass, Steven N.
• Primary Examiner(s): Smith; Bradley K
• Assistant Examiner(s): KARIMY, MOHAMMAD TIMOR
• Application Number:
  US11/128,052
• Publication Number:
  US 20060255467A1
• Time in Patent Office: 1,763 Days
• Field of Search: 257/693, 257/687, 257/726, 257/727
• US Class Current: 257/726
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 24/46 of a plurality of wire connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/168 Wrong mounting prevention
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Claims

1. An apparatus, comprising:

an integrated circuit package, comprising;

an enclosure comprising a dielectric housing, a first electrical contact, and a second electrical contact, wherein said dielectric housing, said first electrical contact, and said second electrical contact are configured to form a contact side of said enclosure;

an integrated circuit die situated within said enclosure and electrically coupled to said first and second electrical contacts;

a data processing equipment including third and fourth electrical contacts; and

a mechanism to apply a continuous positive pressure on the integrated circuit package, the data processing equipment, or both the integrated circuit package and the data processing equipment whenever the integrated circuit package is attached to the data processing equipment, in a manner that the first and second electrical contacts of the integrated circuit package make direct bondless, and solderless, secure electrical-mechanical connections respectively to the third and fourth electrical contacts of the data processing equipment to facilitate an attachment or removal of the integrated circuit package to and from the data processing equipment.

2. The apparatus of claim 1, wherein said integrated circuit package is hosted by a hosting device.

3. The apparatus of claim 2, wherein said data processing equipment comprises a printer, and wherein said hosting device comprises a printer cartridge.

4. The apparatus of claim 2, wherein said integrated circuit die comprises an authentication device for authenticating said hosting device.

5. The apparatus of claim 4, wherein said authentication device performs any one or more of the following operations:

a secure hash algorithm;

a cryptographic operation;

a password entry operation.

6. The apparatus of claim 2, wherein said integrated circuit package includes a memory for storing information related to said hosting device.

7. The apparatus of claim 1, wherein said first and third electrical contacts are electrically connected to ground potential.

8. The apparatus of claim 1, wherein said second and fourth electrical contacts are electrically connected to a power supply source.

9. The apparatus of claim 1, wherein said second and fourth electrical contacts are electrically connected to a communication source.

10. The apparatus of claim 1, wherein said mechanism comprises a clamp.

11. The apparatus of claim 1, wherein said mechanism comprises a spring-loaded device.

12. The apparatus of claim 1, wherein said first electrical contact includes a length of at least two millimeters and a width of at least two millimeters, and wherein said second electrical contact includes a length of at least two millimeters and a width of at least two millimeters.

13. The apparatus of claim 1, wherein said integrated circuit die comprises a calibration device used for calibrating the data processing equipment.

14. The apparatus of claim 1, wherein said third and fourth electrical contacts respectively comprise spring-loaded contacts.

15. The apparatus of claim 1, wherein said integrated circuit die comprises an authentication device for authenticating said data processing equipment.

16. The apparatus of claim 1, wherein each of the first and second electrical contacts are sized to have a length of at least 2 millimeters and a width of at least 2 millimeters in order to achieve the direct bondless, and solderless, electrical-mechanical connections.