Support structure for MEMS device and methods therefor
First Claim
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1. A microelectromechanical systems device comprising:
- a substrate having a first electrode layer formed thereon;
a second electrode layer spaced apart from the first electrode layer by a cavity;
at least one support structure comprising side surfaces surrounding the support structure;
a protective material surrounding the at least one support structure to laterally isolate the at least one support structure from the cavity, the protective material covering all of the side surfaces and preventing exposure of the side surfaces to the cavity;
a first layer formed over the substrate; and
a second layer formed over the first layer,wherein the at least one support structure is interposed between the first and second layers,wherein the protective material, the first layer, and the second layer together encapsulate the at least one support structure, andwherein the at least one support structure is configured to support the second electrode layer.
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Abstract
A microelectromechanical systems device having support structures formed of sacrificial material surrounded by a protective material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a sacrificial material.
183 Citations
41 Claims
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1. A microelectromechanical systems device comprising:
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a substrate having a first electrode layer formed thereon; a second electrode layer spaced apart from the first electrode layer by a cavity; at least one support structure comprising side surfaces surrounding the support structure; a protective material surrounding the at least one support structure to laterally isolate the at least one support structure from the cavity, the protective material covering all of the side surfaces and preventing exposure of the side surfaces to the cavity; a first layer formed over the substrate; and a second layer formed over the first layer, wherein the at least one support structure is interposed between the first and second layers, wherein the protective material, the first layer, and the second layer together encapsulate the at least one support structure, and wherein the at least one support structure is configured to support the second electrode layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making an interferometric modulator device, comprising:
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providing a substrate having a first electrode layer formed over the substrate; depositing a sacrificial material over the first electrode layer; surrounding at least one support structure comprising side surfaces with a protective material after depositing the sacrificial material such that all of the side surfaces are covered and surrounded by the protective material; and creating a cavity between the first electrode layer and a movable layer after surrounding the at least one support structure, wherein the protective material laterally isolates the at least one support structure from the cavity, wherein surrounding the at least one support structure comprises; etching at least one annular opening in the sacrificial material after depositing the sacrificial material; and filling the at least one annular opening with the protective material to surround the at least one support structure. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification