MEMS using filler material and method

• US 7,684,104 B2
• Filed: 08/22/2005
• Issued: 03/23/2010
• Est. Priority Date: 09/27/2004
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: IDC, LLC
• Inventors: Chui, Clarence, Sampsell, Jeffrey B.
• Primary Examiner(s): Mack; Ricky L
• Assistant Examiner(s): Tra; Tuyen Q
• Application Number:
  US11/208,809
• Publication Number:
  US 20060066936A1
• Time in Patent Office: 1,674 Days
• Field of Search: 359/290, 359/292, 359/295, 359/298, 359/220, 359/222, 359/223, 359/224, 359/320, 359/322, 359/245, 359/291, 359/248, 359/254
• US Class Current: 359/290
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 3/007 For controlling stiffness, e.g. ribs
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G09G 3/3466 based on interferometric effect

Abstract

Described is an apparatus, method for manufacturing, and systems comprising a MEMS device, for example, an interferometric modulator, comprising a substrate, a movable mirror, a deformable layer, and a support structure. In some embodiments, the support structure comprises a plurality of support posts. A connector secures the movable mirror secured to the deformable layer. At least one of the connector and the support post is a composite comprising a first component and a second component, where at the first component forms at least a portion of at least one of the perimeter of the connector and support post.

Claims

1. A microelectromechanical systems device comprising:

a substrate;

a deformable layer;

a support structure supporting the deformable layer;

a movable conductor positioned vertically between the substrate and the deformable layer, wherein at least a portion of the movable conductor is electrically conductive; and

a connector securing the movable conductor to the deformable layer vertically below the deformable layer;

wherein

at least one of the connector and the support structure comprises a first component and a second component,

at least a portion of the first component is disposed on a perimeter of at least one of the connector and the support structure such that at least a portion of the first component is horizontally adjacent to and forms sides of at least a lower portion of the second component;

the second component forms a core of the at least one of the connector and the support structure; and

the first component comprises a non-electrically conductive filler material, wherein the filler material is a spin-on material.

2. The microelectromechanical systems device of claim 1, wherein the support structure comprises a plurality of support posts, wherein the support posts are supported by the substrate and support the deformable layer.

3. The microelectromechanical systems device of claim 1, wherein the filler material comprises a self-planarizing material.

4. The microelectromechanical systems device of claim 1, wherein the filler material comprises a material selected from the group consisting of a dielectric material, a metal, and silicon.

5. The microelectromechanical systems device of claim 1, wherein the connector and deformable layer are integrated.

6. The microelectromechanical systems device of claim 1, wherein

the connector comprises a first component and a second component, and

the first component is annular, forming the sides of at least a portion of the connector.

7. The microelectromechanical systems device of claim 6, wherein the first component forms the sides of the entire connector.

8. The microelectromechanical systems device of claim 7, wherein the second component comprises a sacrificial material.

9. The microelectromechanical systems device of claim 8, wherein the sacrificial material comprises molybdenum, silicon, or a combination thereof.

10. The microelectromechanical systems device of claim 1, wherein at least one support post comprises a support post plug substantially formed from filler material.

11. The microelectromechanical systems device of claim 1, wherein the microelectromechanical systems device is an optical modulator.

12. The microelectromechanical systems device of claim 1, wherein:

the connector comprises a first component, and

the first component contacts the movable conductor and forms the sides of the lower portion of the connector.

13. The microelectromechanical systems device of claim 12, wherein the second component comprises a conductor.

14. The microelectromechanical systems device of claim 1, further comprising:

a display;

a processor that is in electrical communication with said display, said processor being configured to process image data;

a memory device in electrical communication with said processor.

15. The microelectromechanical systems device of claim 14, further comprising:

a driver circuit configured to send at least one signal to said display.

16. The microelectromechanical systems device of claim 15, further comprising:

a controller configured to send at least a portion of said image data to said driver circuit.

17. The microelectromechanical systems device of claim 14, further comprising:

an image source module configured to send said image data to said processor.

18. The microelectromechanical systems device of claim 17, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.

19. The microelectromechanical systems device of claim 14, further comprising:

an input device configured to receive input data and to communicate said input data to said processor.