Controlled shape semiconductor layer by selective epitaxy under seed structure

• US 7,686,886 B2
• Filed: 09/26/2006
• Issued: 03/30/2010
• Est. Priority Date: 09/26/2006
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Riel, Heike E, Karg, Siegfried F, Riess, Walter H, Schmid, Heinz
• Primary Examiner(s): Kunemund; Robert M
• Assistant Examiner(s): Song; Matthew J
• Application Number:
  US11/535,122
• Publication Number:
  US 20080072816A1
• Time in Patent Office: 1,281 Days
• Field of Search: 117/1, 117/90, 117/94, 117/97, 117/101, 117/106, 117/921, 117/902, 117/935, 257/1, 423/1, 438/1
• US Class Current: 117/90
• CPC Class Codes: C30B 29/60 characterised by shape
• CPC Class Codes: Y10S 117/902 Specified orientation, shape, crystallography, or size of seed or substrate

Abstract

A method for forming a structure of a desired cross-section on a substrate is provided. The method provides a seed structure comprising at least one support layer on the substrate. The support layer has a geometric shape related to the desired cross-section of the structure and is diffusive to a precursor constituent. The method further includes growing the structure by supplying at least one precursor constituent on the substrate. The desired cross-section of the structure is defined by the geometric shape of at least one support layer.

Claims

1. A method of epitaxially growing a monocrystalline semiconductor region, comprising:

a) lithographically defining a seed structure overlying a surface of a first monocrystalline semiconductor region of a substrate, the seed structure including (i) a support layer extending along the surface in a first lateral direction and a second lateral direction transverse to the first direction, the support layer having a major surface and a plurality of exposed lithographically defined edge surfaces bounding the major surface and extending away from the major surface, wherein an adjacent pair of the edge surfaces are disposed at an angle so as to define a vertex, the seed structure further including (ii) a catalytically active covering layer wetting the support layer and disposed between the surface of the semiconductor region and the support layer, the covering layer having an exposed periphery; and

b) then selectively, epitaxially growing a second monocrystalline semiconductor region onto the first monocrystalline semiconductor region where covered by the seed structure by supplying precursor constituent to the seed structure including to the exposed periphery of the covering layer, such that the covering layer adsorbs the precursor constituent through the exposed periphery, the second monocrystalline semiconductor region having edge surfaces which are co-planar with the edge surfaces of the support layer.

2. The method of claim 1, wherein step (b) includes heating the seed structure in the presence of the precursor constituent.

3. The method of claim 1, wherein the support layer is diffusive to the precursor constituent.

4. The method of claim 1, wherein step (b) includes growing a first portion of the second monocrystalline semiconductor region having a first composition and growing a second portion of the second monocrystalline semiconductor region having a second composition to form a crystalline hetero-structure.

5. The method of claim 4, wherein step (b) includes growing the first portion of the second monocrystalline semiconductor region to form a core region and growing the second portion of the second monocrystalline semiconductor region to form a shell region covering the core region.

6. The method of claim 1, wherein the geometric shape of the support layer is defined by lithography.

7. The method of claim 1, wherein each of the support layer and the cover layer comprises a material selected from a group comprising metals, metal alloys, semiconductors and insulators.

8. The method of claim 7, wherein the metals comprise one of gold, gallium, nickel, lead, iron, copper, and aluminum or any combination thereof.

9. The method of claim 1, wherein the precursor constituent is selected from a group comprising halides, halogens, silanes, germanes, metallo-organic compounds, molecules containing semiconductor constituents, and compositions of molecules containing boron, antimony, carbon, arsene, phosphorous, and sulphur.

10. A method of epitaxially growing a monocrystalline semiconductor region, comprising:

a) lithographically defining a seed structure overlying a surface of a first monocrystalline semiconductor region of a substrate, the seed structure including (i) a support layer extending along the surface in a first lateral direction and a second lateral direction transverse to the first direction, the support layer having a major surface and a plurality of exposed lithographically defined edge surfaces bounding the major surface and extending away from the major surface, wherein an adjacent pair of the edge surfaces are disposed at an angle so as to define a vertex, the seed structure further including (ii) a catalytically active covering layer wetting the support layer and disposed between the surface of the semiconductor region and the support layer, the covering layer having an exposed periphery; and

b) then selectively, epitaxially growing a second monocrystalline semiconductor region onto the first monocrystalline semiconductor region where covered by the seed structure using a precursor constituent adsorbed by the covering layer through at least the exposed periphery of the covering layer, the second monocrystalline semiconductor region having edge surfaces which are co-planar with the edge surfaces of the support layer.

11. A structure including an epitaxially grown monocrystalline semiconductor region, comprising:

a seed structure overlying a surface of a first monocrystalline semiconductor region of a substrate, the seed structure including (i) a support layer extending along the surface in a first lateral direction and a second lateral direction transverse to the first direction, the support layer having a major surface and a plurality of exposed lithographically defined edge surfaces bounding the major surface and extending away from the major surface, wherein an adjacent pair of the edge surfaces are disposed at an angle so as to define a vertex, the seed structure further including (ii) a catalytic covering layer wetting the support layer and disposed between the surface of the semiconductor region and the support layer, the covering layer having an exposed periphery; and

a second monocrystalline semiconductor region selectively, epitaxially grown onto the first monocrystalline semiconductor region where covered by the seed structure using a precursor constituent adsorbed by the cover layer through at least the exposed periphery of the covering layer, the second monocrystalline semiconductor region having edge surfaces which are co-planar with the edge surfaces of the support layer.

12. The structure as claimed in claim 11, wherein the support layer is diffusive to the precursor constituent.

13. The structure as claimed in claim 12, wherein the structure is an in-process structure.

14. The structure as claimed in claim 11, further comprising growing a third semiconductor region to form a shell region covering the core region.

15. The structure as claimed in claim 11, wherein the edge surfaces of the support layer is defined by lithography.

16. The structure as claimed in claim 11, wherein the support layer includes a material selected from a group comprising a metal, metal alloys, semiconductors and insulators.

17. The structure as claimed in claim 11, wherein the metal includes at least one metal selected from the group consisting of gold, gallium, nickel, lead, iron, copper, and aluminum.

18. The structure as claimed in claim 11, wherein the precursor constituent includes at least one selected from the group consisting of halides, halogens, silanes, germanes, metallo-organic compounds;

molecules containing semiconductor constituents, and compositions of molecules containing boron, antimony, carbon, arsene, phosphorous, and sulphur.