Cooling systems incorporating heat transfer meshes

• US 7,694,722 B2
• Filed: 12/01/2006
• Issued: 04/13/2010
• Est. Priority Date: 12/23/2004
• Status: Expired due to Fees

• Current Assignee: Olantra Fund X LLC (Intellectual Ventures LLC)
• Original Assignee: OnScreen Technologies, Inc.
• Inventors: Popovich, John M.
• Primary Examiner(s): Walberg, Teresa J
• Application Number:
  US11/606,819
• Publication Number:
  US 20070074853A1
• Time in Patent Office: 1,229 Days
• Field of Search: 165/80.4, 165/80.5, 165/185
• US Class Current: 165/80.4
• CPC Class Codes: F28F 1/122 and being formed of wires
• CPC Class Codes: F28F 1/405 and being formed of wires
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: H01L 2224/29499 Shape or distribution of the fillers
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H04B 10/00 Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
• CPC Class Codes: H05K 7/20245 by natural convection; Thermosiphons

Abstract

Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.

Claims

1. Apparatus for cooling of an electrical element package, comprising in combination

a) structure including a hollow body, defining a cavity containing cooling fluid,

b) the structure defining an opening or passage whereby direct contact of the cooling fluid with said package is established for heat transfer from the package to the fluid contained in the cavity,

c) a mesh located to enhance said heat transfer, said mesh being in direct contact with said package

d) and means for circulating the fluid to flow via the mesh and to transfer heat to other heat transfer means acting to remove heat from the fluid,

e) and including a fluid seal between surfaces defined by said body and the package, adjacent said opening,

f) said package including a heat spreader,

g) and wherein said mesh is a first mesh, and including a second mesh receiving coolant fluid from the first mesh, for receiving heat therefrom and for transferring heat to heat dissipating means,

h) and wherein said first mesh is substantially planar, and said coolant fluid flows within the first mesh in the direction or directions of planar extent thereof, and said second mesh is substantially planar and said coolant fluid flows within the second mesh in the direction or directions of planar extent thereof,

i) said means having guide structure for guiding said fluid into the first mesh in a direction generally parallel to said lengthwise extent of the first mesh, and for channeling said flow within the first mesh into said direct contact with the package.

2. The combination of claim 1 wherein said mesh is associated with said opening or passage, in the path of fluid displacement to enhance said heat transfer to the fluid as fluid flows through tortuous passages defined by lengthwise extent of the mesh.

3. The combination of claim 2 wherein said mesh is a micro-mesh.

4. The combination of claim 2 wherein said mesh extends crosswise of said opening.

5. The combination of claim 4 wherein said mesh defines a dutch weaving strand pattern.

6. The combination of claim 3 wherein said mesh is a micro-mesh that extends in covering relation with said opening.

7. The combination of claim 6 wherein said mesh defines a dutch weaving strand pattern.

8. The combination of claim 6 wherein said wires are woven.

9. The combination of claim 1 including a pump acting to displace the fluid along a circulation path, associated with the cavity.

10. Heat transfer apparatus as defined in claim 1 wherein each mesh is a wire mesh.

11. The combination of claim 1 wherein said first mesh is in contact with said guide structure.

12. The combination of claim 1 wherein wires defined by each mesh are metallic.

13. The combination of claim 1 including other means for transferring heat from the second mesh.

14. The combination of claim 1 wherein the first mesh includes wires characterized by one or more of the following:

i) square array weave pattern,

ii) triangular array weave pattern

iii) dielectric coating on the wires,

iv) dielectric coating on the wires interrupted by electrical contact surface zones free of dielectric coating,

v) zones to which switching elements or diodes are attached,

vi) zones to which LEDs are attached,

vii) zones to which LASERS are attached,

viii) wires extending in one general direction being power conduits, and wires extending in another general direction being communications signal conduits,

ix) Dutch weave,

x) more than one million addressable nodes per square inch.

15. The apparatus of claim 1 including electrical circuitry in electrical communication with mesh wires.