Surface mount optoelectronic component

• US 7,696,526 B2
• Filed: 01/29/2004
• Issued: 04/13/2010
• Est. Priority Date: 01/29/2004
• Status: Active Grant

• Current Assignee: Dominant OPTO Technologies Sendirian Berhad (D & O Ventures Berhad)
• Original Assignee: Dominant OPTO Technologies Sendirian Berhad (D & O Ventures Berhad)
• Inventors: Tay, Kheng Chiong, Lai, Khin Shin, Low, Tek Beng
• Primary Examiner(s): Purvis; Sue
• Assistant Examiner(s): REAMES, MATTHEW L
• Application Number:
  US10/766,468
• Publication Number:
  US 20050168922A1
• Time in Patent Office: 2,266 Days
• Field of Search: 257/98, 257/99, 257/100, 257666-677, 257/690, 257/E25.028, 257/E25.019, 362/610
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 7/1061 co-operating by abutting

Abstract

The invention relates to a surface mount optoelectronic component. A thick, electrically conductive material is used to serve as a base material for the assembly. An opaque plastic material is used to provide housing for the whole component. A cavity formed on a top surface of the optoelectronic component is designed within the plastic material. An optoelectronic chip is mounted within this cavity. This cavity is filled with a hard transparent or translucent resin material so that optical radiation may be transmitted or received via this window. Electrical connection(s) between the chip and the base material is/are provided by a metallic wire (4). Subsequent connections to external sub-systems, such as PCBs, are provided by the base material itself. No extra mechanical forming processes are necessary to create the connections. The base material extends all the way from a middle portion to a bottom surface of the optoelectronic component, and to one of the side surfaces, ultimately extending and protruding outside the package. The bottom surface is used for connection when a top illuminator is required. Alternatively, one of the side surfaces could be used for connection when the optoelectronic component is used as a side illuminator.

Claims

1. An optoelectronic component based on a surface mount technology, the optoelectronic component comprising:

an electrically conductive frame forming a base including multiple separate base sections for an assembly;

an opaque plastic material forming a housing for the assembly;

a cavity formed within the plastic material;

at least one protrusion extending from a side surface of the housing to provide heat dissipation; and

at least one optoelectronic chip mounted in the cavity,

wherein the base emanates from an internal middle portion and each of the base sections protrudes from a bottom surface and at least one of two other side surfaces of the housing, so as to extend past the bottom surface and the two other side surfaces of the housing, the bottom surface and the two other side surfaces of the housing providing external mounting connection terminals.

2. The optoelectronic component as claimed in claim 1, wherein the cavity is filled with a transparent or translucent resin material.

3. The optoelectronic component as claimed in claim 1, wherein an electrical connection between the at least one optoelectronic chip and the base is provided by a metallic wire.

4. The optoelectronic component as claimed in claim 1, wherein the external mounting connection terminals are provided for connecting to external sub-systems.

5. The optoelectronic component as claimed in claim 1, wherein the base protrudes outside the plastic material.

6. The optoelectronic component as claimed in claim 1, wherein the external mounting connection terminals are provided without any lead formations.

7. The optoelectronic component as claimed in claim 1, wherein the at least one protrusion extending from a side surface to provide heat dissipation extends further from the side surface than the base protrusion on the bottom surface extends from the bottom surface.

8. The optoelectronic component as claimed in claim 1, wherein the base protrusion on the bottom surface extends along the bottom surface for at least a third of a length of the bottom surface.

9. The optoelectronic component as claimed in claim 1, wherein the base comprises two separate base sections, each of the base sections protruding from the bottom surface and at least one of the two other side surfaces.

10. The optoelectronic component as claimed in claim 9, wherein one of the two base sections is larger than the other in the middle portion and the protrusions of the two base sections have identical dimensions outside the housing.

11. The optoelectronic component as claimed in claim 10, wherein the optoelectronic chip is arranged on the larger one of the two base sections.

12. An optoelectronic component based on a surface mount technology, the optoelectronic component comprising:

an electrically conductive frame forming a base for an assembly, the base including multiple separate base sections;

an opaque plastic material forming a housing for the assembly;

a cavity formed within the plastic material;

at least one protrusion extending from a side surface of the housing to provide heat dissipation; and

at least one optoelectronic chip mounted in the cavity, wherein the electrically conductive frame emanates from an internal middle portion and each of the base sections protrudes to at least one of two other side surfaces and a bottom surface of the housing, so as to extend past the two other side surfaces and the bottom surface of the housing, the bottom surface and the two other side surfaces of the housing providing external mounting connection terminals.

13. The optoelectronic component as claimed in claim 12, wherein the cavity is filled with a transparent or translucent resin material.

14. The optoelectronic component as claimed in claim 12, wherein the external mounting connection terminals are provided without any lead formations.

15. The optoelectronic component as claimed in claim 12, wherein an electrical connection between the at least one optoelectronic chip and the base is provided by a metallic wire.

16. The optoelectronic component as claimed in claim 12, wherein the external mounting connection terminals are provided for connecting to external sub-systems such as PCBs.

17. The optoelectronic component as claimed in claim 12, wherein the electrically conductive frame comprises two separate frames, each of the frames protruding from at least one of the two other side surfaces.

18. The optoelectronic component as claimed in claim 17, wherein one of the two frames is larger than the other in the middle portion.

19. The optoelectronic component as claimed in claim 18, wherein the protrusions of the two frames have identical dimensions outside the housing.

20. The optoelectronic component as claimed in claim 18, wherein the optoelectronic chip is arranged on the larger one of the frames.