Solid-state imaging device

  • US 7,696,543 B2
  • Filed: 04/04/2006
  • Issued: 04/13/2010
  • Est. Priority Date: 03/07/2003
  • Status: Active Grant
First Claim
Patent Images

1. A solid-state imaging device, comprising:

  • a plurality of photodiodes for performing optical-electrical conversion, each of the photodiodes being two-dimensionally arranged in row and column directions on a semiconductor substrate;

    a plurality of transfer gates for transferring a signal electric charge obtained from performing the optical-electrical conversion, each of the transfer gates being provided on the semiconductor substrate for a corresponding one of the photodiodes;

    a plurality of floating diffusion layers for temporarily storing the transferred signal electric charge, each of the floating diffusion layers being provided for at least one of the corresponding photodiodes and at least one of the corresponding transfer gates;

    an amplifier transistor for amplifying the signal electric charge supplied to a gate thereof, the amplifier transistor being provided on the semiconductor substrate;

    a reset transistor for resetting the signal electric charge stored in the floating diffusion layer, the reset transistor being provided on the semiconductor substrate; and

    a vertical signal line for outputting a signal corresponding to the signal electric charge in the floating diffusion layer,wherein a floating diffusion layer included in at least one active region is connected to a gate of an amplifier transistor included in an active region adjacent to said floating diffusion layer in the column direction, andwherein the vertical signal line outputs the signal in the column direction,a first contact hole is provided on the floating diffusion layer so as to connect the floating diffusion layer and a gate of the amplifier transistor,a second contact hole is provided on a gate of the amplifier transistor so as to connect the floating diffusion layer and the gate of the amplifier transistor, andthe first contact hole and the second contact hole are aligned in the column direction.

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