Diode housing

• US 7,696,590 B2
• Filed: 03/26/2008
• Issued: 04/13/2010
• Est. Priority Date: 06/30/1998
• Status: Expired due to Fees

• Current Assignee: OSRAM GmbH (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Waitl, Gunter, Brunner, Herbert
• Primary Examiner(s): MANDALA, MICHELLE
• Application Number:
  US12/055,863
• Publication Number:
  US 20080173878A1
• Time in Patent Office: 748 Days
• Field of Search: 257/99, 257 79-103, 257/434, 257/680, 257/E33.07, 257/E33.072
• US Class Current: 257/434
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

Claims

1. An electromagnetic radiation emitting or radiation receiving surface mountable semiconductor device comprising:

a housing having a base and a recess, said recess defined by at least one sidewall and at least one bottom wall,

a conductor accommodated within said housing, said conductor having at least one first conductor portion and at least one second conductor portion being electrically isolated from each other,

said at least one bottom wall partially covering said conductor such that the conductor is arranged partially between said base and said bottom walls, and

at least one semiconductor chip which is bonded to said conductor, wherein the at least one bottom wall covers the conductor on a side of the conductor on which the at least one semiconductor chip is bonded to the conductor.

2. A semiconductor device according to claim 1,

having at least two bottom walls, wherein said bottom walls extend towards one another from opposing starting points on said sidewalls.

3. Semiconductor device according to claim 1,

having at least two bottom walls, wherein said bottom walls extend towards one another along a substantially coplanar direction.

4. The semiconductor device according to claim 1,

wherein elongated portions of said at least one bottom wall cover parts of said conductor.

5. The semiconductor device according to claim 1,

further comprising a radiation permeable window which is at least in parts in direct contact with said at least one bottom wall.

6. The semiconductor device according to claim 5,

wherein borders of said radiation permeable window are defined by said at least one sidewall and said at least one bottom wall.

7. The semiconductor device according to claim 1,

wherein said at least one bottom wall has a diffuse reflectivity of at least 80%.

8. The semiconductor device according to claim 1,

wherein said semiconductor chip is arranged in an open area where the conductor is free of said at least one bottom wall.

9. The semiconductor device according to claim 1,

wherein said at least one sidewall defines a circular opening in which a radiation permeable window is formed.

10. The semiconductor device according to claim 1,

wherein said at least one sidewall is positioned at an obtuse angle with respect to a plane defined by said conductor.

11. The semiconductor device according to claim 1,

wherein said at least one sidewall is positioned at an obtuse angle with respect to a plane defined by said at least one bottom wall.

12. An electromagnetic radiation emitting or radiation receiving surface mountable semiconductor device comprising:

a housing a base and a recess, said recess defined by sidewalls and bottom walls,

a conductor accommodated within said housing, said conductor having at least one first conductor portion and at least one second conductor portion being electrically isolated from each other,

said bottom walls partially covering said conductor such that the conductor is arranged partially between said base and said bottom walls,

at least one semiconductor chip which is bonded to said conductor, and

a radiation permeable window which is at least in parts in direct contact with said bottom walls.

13. The semiconductor device according to claim 12, wherein borders of said radiation permeable window are defined by said sidewalls and said bottom walls.

14. An electromagnetic radiation emitting or radiation receiving surface mountable semiconductor device comprising:

a housing a base and a recess, said recess defined by sidewalls and bottom walls,

a conductor accommodated within said housing, said conductor having at least one first conductor portion and at least one second conductor portion being electrically isolated from each other,

said bottom walls partially covering said conductor such that the conductor is arranged partially between said base and said bottom walls, and

at least one semiconductor chip which is bonded to said conductor, wherein said bottom walls have a diffuse reflectivity of at least 80%.

15. An electromagnetic radiation emitting or radiation receiving surface mountable semiconductor device comprising:

a housing a base and a recess, said recess defined by sidewalls and bottom walls,

a conductor accommodated within said housing, said conductor having at least one first conductor portion and at least one second conductor portion being electrically isolated from each other,

said bottom walls partially covering said conductor such that the conductor is arranged partially between said base and said bottom walls, and

at least one semiconductor chip which is bonded to said conductor, wherein said sidewalls define a circular opening in which a radiation permeable window is formed.