Kit and method for constructing vibration suppression and/or sensing units

• US 7,701,111 B2
• Filed: 09/10/2008
• Issued: 04/20/2010
• Est. Priority Date: 02/18/2005
• Status: Expired due to Fees

• Current Assignee: Intelligent Dynamics Canada Ltd.
• Original Assignee: Iptrade Limited
• Inventors: Pletner, Baruch, Zvonar, Gregory A.
• Primary Examiner(s): BUDD, MARK OSBORNE
• Application Number:
  US12/208,119
• Publication Number:
  US 20090007672A1
• Time in Patent Office: 587 Days
• Field of Search: 310/311, 310/317, 310/319, 310/316.01, 310/348, 310334-337
• US Class Current: 310/311
• CPC Class Codes: F16F 15/00 Suppression of vibrations in systems damping of non-rotary systems using inertia effect F16F7/10; prevention or isolation of vibrations in machine tools B23Q11/0032; suppression of driveline vibrations in hybrid vehicle transmissions B60W30/20 ; vehicle seat suspension devices B60N2/50; methods or devices for protecting against, or damping of, acoustic waves, e.g. sound G10K11/16; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion vibration absorbing or balancing means for aircraft propellers B64C11/008, for rotorcraft rotors B64C27/001 ; testing static and dynamic balance of machines or structures G01M1/00

Abstract

Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.

Claims

1. A kit for use in analyzing or suppressing vibrations in equipment, comprising:

an electrical-mechanical transducer configured for being placed in operative contact with the equipment;

a first device carrying electronic componentry configured for transmitting vibration drive signals to the electrical-mechanical transducer;

a second device carrying electronic componentry configured for receiving vibration sensing signals from the electrical-mechanical transducer, wherein the first and second devices have different functions; and

a housing in which the first and second devices can be interchangeably mounted.

2. The kit of claim 1, wherein the electrical-mechanical transducer is a piezoelectric element.

3. The kit of claim 1, wherein the first and second devices are printed circuit boards.

4. The kit of claim 1, wherein the housing is configured for receiving the electrical-mechanical transducer.

5. The kit of claim 1, wherein the electronic componentry carried by the first device comprises an amplifier for transmitting the vibration drive signals to the electrical-mechanical transducer, and control circuitry for transmitting vibration suppression control signals to the amplifier, wherein the control circuitry is electrically isolated from the amplifier.

31. The kit of claim 1, wherein the first device is a dedicated actuating device, and the second device is a dedicated sensing device.

32. The kit of claim 1, wherein the housing has a ledge on which the first device and the second device can be interchangeably mounted.

35. The kit of claim 1, wherein the first device has a first connector configured for being removably mated with the electrical-mechanical transducer, and the second device has a second connector configured for being removably mated with the electrical-mechanical transducer.

36. The kit of claim 1, further comprising fasteners configured for removably mounting each of the first and second devices within the housing.

37. The kit of claim 1, wherein the first device is one of a master actuating device, a slave actuating device, and a sensing device, and the second device is a different one of the master actuating device, slave actuating device, and sensing device.

6. A method of implementing a vibration suppression system on equipment, comprising:

mounting an electrical-mechanical transducer to the equipment;

connecting first electronic componentry to the electrical-mechanical transducer;

transmitting vibration sensing signals from the electrical-mechanical transducer to the first electronic componentry in response to vibrations in the equipment;

removing the first electronic componentry from the electrical-mechanical transducer;

connecting second electronic componentry to the electrical-mechanical transducer; and

transmitting electrical drive signals from the second electronic componentry to the electrical-mechanical transducer to induce vibrations at equipment.

7. The method of claim 6, wherein the electrical-mechanical transducer comprises a piezoelectric element.

8. The method of claim 6, wherein the first and second electronic componentry are carried by printed circuit boards.

9. The method of claim 6, further comprising analyzing the vibration sensing signals, and modifying the second electronic componentry based on the analysis.

10. The method of claim 9, wherein the second electronic componentry is modified by programming it with a vibration suppression control algorithm.

11. A kit for use in analyzing or suppressing vibrations in equipment, comprising:

a base plate configured for being mounted to the equipment;

an electrical-mechanical transducer configured for being directly mounted to the base plate;

a case configured for being mounted to the base plate over the electrical-mechanical transducer, wherein the case comprises an aperture for receiving the electrical-mechanical transducer; and

electronic componentry configured for being mounted within the case in operative connection with the electrical-mechanical transducer.

12. The kit of claim 11, wherein the electrical-mechanical transducer comprises a piezoelectric element.

13. The kit of claim 11, wherein the electronic componentry is carried by a printed circuit board.

14. The kit of claim 11, wherein the base plate comprises a recess configured for seating the electrical-mechanical transducer.

15. The kit of claim 11, further comprising an electromagnetic interference (EMI) shield configured for being mounted within the case between the electronic componentry and the electrical-mechanical transducer.

16. The kit of claim 11, wherein the electronic componentry is configured for being removably mounted within the case.

17. The kit of claim 11, further comprising a cover configured for enclosing the electronic componentry and the electrical-mechanical transducer within the case.

18. The kit of claim 11, wherein the case is composed of an electrically insulative material.

19. The kit of claim 11, wherein the base plate is configured for transferring vibrations between the electrical-mechanical transducer and the equipment with substantially no loss.

20. The kit of claim 11, wherein the electronic componentry comprises an amplifier for transmitting vibration drive signals to the electrical-mechanical transducer, and control circuitry for transmitting vibration suppression control signals to the amplifier, wherein the control circuitry is electrically isolated from the amplifier.

33. The kit of claim 16, wherein the electronic componentry is configured for being removed from the case without destroying the case.

21. A method of installing a vibration sensing or actuating device onto equipment, comprising:

mounting a base plate onto the equipment;

permanently mounting an electrical-mechanical transducer onto the base plate;

permanently mounting a case to the base plate over the electrical-mechanical transducer, wherein the electrical-mechanical transducer is exposed to the inside of the case;

mounting electronic componentry within the case; and

operatively connecting the electronic componentry to the electrical-mechanical transducer.

22. The method of claim 21, wherein the electrical-mechanical transducer comprises a piezoelectric element.

23. The method of claim 21, wherein the electronic componentry is carried by a printed circuit board.

24. The method of claim 21, further comprising seating the electrical-mechanical transducer within a recess formed within the base plate.

25. The method of claim 21, further comprising mounting an electromagnetic interference (EMI) shield within the case between the electronic componentry and the electrical-mechanical transducer.

26. The method of claim 21, wherein the electronic componentry is removably mounted within the case.

27. The method of claim 21, further comprising enclosing the electronic componentry and the electrical-mechanical transducer within the case with a cover.

28. The method of claim 21, wherein the case is composed of an electrically insulative material.

29. The method of claim 21, wherein the base plate is permanently mounted to the equipment.

30. The method of claim 21, wherein the electrical-mechanical transducer and casing are bonded to the base plate.

34. The method of claim 26, wherein the electronic componentry is configured for being removed from the case without destroying the case.