Package structure for ESD protection of light-emitting device

• US 7,714,349 B2
• Filed: 03/12/2007
• Issued: 05/11/2010
• Est. Priority Date: 12/18/2006
• Status: Active Grant

• Current Assignee: Lextar Electronics Corporation
• Original Assignee: Lighthouse Technologies (Lextar Electronics Corporation)
• Inventors: Su, Wen-Lung
• Primary Examiner(s): Tran; Minh-Loan T
• Assistant Examiner(s): KUO, WENSING W
• Application Number:
  US11/684,644
• Publication Number:
  US 20080142831A1
• Time in Patent Office: 1,156 Days
• Field of Search: 257/98, 257/99, 257/100, 257/687, 257/693, 257/724, 257E33056-E33059, 257/E33.066
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A package structure including a first lead, a second lead, an encapsulant, a light-emitting device and an electrostatic discharge (ESD) protection device is provided. The second lead is disposed beside the first lead, and parts of the first lead and the second lead are encapsulated by the encapsulant. The encapsulant has a first cavity and a second cavity. Parts of the first lead and the second lead are exposed by the first cavity and the other parts of the first lead and the second lead are exposed by the second cavity. The light-emitting device is disposed inside the first cavity and electrically connected to the first lead and the second lead. The ESD protection device is disposed inside the second cavity and electrically connected to the first lead and the second lead.

Claims

1. A package structure, comprising:

a first lead;

a second lead disposed beside the first lead;

an encapsulant encapsulating parts of the first lead and the second lead, wherein the encapsulant comprises a first cavity and a second cavity, the first cavity and the second cavity being located on a same side of the encapsulant, the first cavity exposing parts of the first lead and the second lead, the second cavity exposing the other parts of the first lead and the second lead;

a light-emitting device disposed inside the first cavity and electrically connected to the first lead and the second lead; and

an electrostatic discharge (ESD) protection device disposed inside the second cavity and electrically connected to the first lead and the second lead.

2. The package structure of claim 1, wherein the light-emitting device is disposed on the first lead and the ESD protection device is disposed on the second lead.

3. The package structure of claim 2, further comprising two wires, a first contact pad and a second contact pad being disposed on a top of the light-emitting device, wherein the wires are connected between the first contact pad and the first lead and connected between the second contact pad and the second lead.

4. The package structure of claim 2, further comprising a wire, a third contact pad and a fourth contact pad being respectively disposed on a bottom and a top of the ESD protection device, wherein the third contact pad is in contact with the second lead and the wire is connected between the fourth contact pad and the first lead.

5. The package structure of claim 1, wherein the ESD protection device is a diode.

6. The package structure of claim 5, wherein the diode is a light emitting diode (LED).

7. The package structure of claim 1, wherein the light-emitting device is an LED chip.

8. The package structure of claim 1, further comprising a compound encapsulating the first cavity.

9. The package structure of claim 1, further comprising a compound encapsulating the second cavity.

10. The package structure of claim 1, wherein the encapsulant further comprises a third cavity.

11. The package structure of claim 1, wherein an anode and a cathode of the light-emitting device are electrically connected to the second lead and to the first lead respectively, and the anode and the cathode of the ESD protection device are electrically connected to the first lead and to the second lead respectively.