Semiconductor device having increased gate-source capacity provided by protruding electrode disposed between gate electrodes formed in a trench
First Claim
1. A semiconductor device, comprising:
- a semiconductor region of a first conduction type;
a first main electrode connected to said semiconductor region;
a base region of a second conduction type formed on said semiconductor region;
a diffused region of the first conduction type formed on said base region;
a second main electrode connected to said diffused region and said base region;
a first trench formed extending from a surface of said diffused region to said semiconductor region;
a second trench formed from a center of a bottom of said first trench, the second trench being much deeper than said first trench and being smaller in lateral width than said first trench;
a gate electrode formed on a side of said first trench via a first insulator film; and
a protruded electrode formed in said second trench via a second insulator film as protruded downward lower than said gate electrode,said protruded electrode being electrically and directly connected to said second main electrode.
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Accused Products
Abstract
A semiconductor device comprises a semiconductor region of the first conduction type. A first main electrode is connected to the semiconductor region. A base region of the second conduction type is formed on the semiconductor region. A diffused region of the first conduction type is formed on the base region. A second main electrode is connected to the diffused region and the base region. A first trench is formed extending from a surface of the diffused region to the semiconductor region. A second trench is formed from the first trench deeper than the first trench. A gate electrode is formed on a side of the first trench via a first insulator film. A protruded electrode is formed in the second trench via a second insulator film as protruded lower than the gate electrode.
11 Citations
9 Claims
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1. A semiconductor device, comprising:
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a semiconductor region of a first conduction type; a first main electrode connected to said semiconductor region; a base region of a second conduction type formed on said semiconductor region; a diffused region of the first conduction type formed on said base region; a second main electrode connected to said diffused region and said base region; a first trench formed extending from a surface of said diffused region to said semiconductor region; a second trench formed from a center of a bottom of said first trench, the second trench being much deeper than said first trench and being smaller in lateral width than said first trench; a gate electrode formed on a side of said first trench via a first insulator film; and a protruded electrode formed in said second trench via a second insulator film as protruded downward lower than said gate electrode, said protruded electrode being electrically and directly connected to said second main electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification