Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame

• US 7,728,345 B2
• Filed: 04/04/2006
• Issued: 06/01/2010
• Est. Priority Date: 08/24/2001
• Status: Active Grant

• Current Assignee: Satco Products Incorporated
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Jackson, Jr., Jerome
• Application Number:
  US11/397,323
• Publication Number:
  US 20060214179A1
• Time in Patent Office: 1,519 Days
• Field of Search: 257/99
• US Class Current: 257/99
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

A semiconductor light source for illuminating physical spaces can include a lead frame with multiple facets. Each facet can have one or more semiconductor light emitting devices located on it.

Claims

1. A semiconductor light source for illuminating a physical space comprising:

a first electrode (hereinafter a “

pin”

) having a cap and a shaft depending therefrom in a generally perpendicular manner;

a second electrode that is a three-dimensional body (hereinafter the “

body”

) comprised of thermally and electrically conductive material and further comprising;

a plurality of facets on an outer perimeter to support semiconductor light emitting devices and a planar top surface located above the facets;

a base, located distally from the facets and defining a bottom of the body, for further connection with a carrier;

a bore, axially located on the body and having a larger diameter than a diameter of the said shaft and smaller than a diameter of the said cap, extending from the planar top surface of the frame through the bottom of the body;

the electrodes being assembled to form a three dimensional lead frame in the following manner;

the pin being disposed such that the shaft extends through the bore and the cap is proximate and external the top planar surface, such that the top planar surface would be at least substantially covered by the cap, with electrically non-conductive insulation situated in the bore and on the top planar surface, between the pin and the body, such it supports the pin in a manner that the pin and body have no direct contact;

at least one semiconductor light emitting device, mounted upon one of the facets of the body in an electrically conductive manner to the frame and having further electrical connection to the pin at the cap; and

an optically transparent cover placed around the facets in the body to protect the at least one semiconductor light emitting device and also capable of shaping and directing a light beam from said devices to be in desired direction.

2. A device as recited in claim 1, the base being threaded for interface with a socket structure.

3. A device as recited in claim 2, wherein the pin extends beyond the base of the body.

4. A device as recited in claim 1, wherein the base is a planar base.

5. A device as recited in claim 4 further comprising electrodes in the planar base allowing for electrical connection to the pin and body.

6. A device as recited in claim 1, wherein said optically transparent cover serves to waterproof the light source.

7. A device as recited in claim 1 further comprising a light conversion layer for converting light emitted to white light.

8. A device as recited in claim 7 wherein said light conversion layer is a phosphor layer.

9. A device as recited in claim 1 wherein the at least one semiconductor light emitting device is at least one semiconductor chip mounted on at least one facet.

10. A device as recited in claim 9, wherein said frame has at least one semiconductor chip mounted on each facet.

11. A device as recited in claim 1 wherein the light source emits light across an arc of 360 degrees.

12. A device as recited in claim 1 wherein the light source emits light across an arc of less than 360 degrees.