Semiconductor device, wiring substrate, and method for manufacturing wiring substrate

  • US 7,728,439 B2
  • Filed: 11/21/2003
  • Issued: 06/01/2010
  • Est. Priority Date: 11/21/2002
  • Status: Active Grant
First Claim
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1. A semiconductor apparatus in which a semiconductor chip is mounted on a wiring substrate with Flip-Chip,wherein the wiring substrate comprises:

  • a monolithic base substrate formed from any one of a silicon, a ceramic, or a photosensitive glass;

    a wiring layer having an insulating layer and a wiring formed on a wiring layer formation surface which is one surface of the monolithic base substrate;

    an electrode formed on a chip mounting surface which is a backside of the wiring layer formation surface of the monolithic base substrate; and

    a through-electrode formed on the monolithic base substrate electrically connecting the wiring layer formed on the wiring layer formation surface and the electrode formed on the chip mounting surface,wherein a thermal expansion coefficient of the monolithic base substrate is equal to a thermal expansion coefficient of the semiconductor chip, and the thermal expansion coefficient of the monolithic base substrate is less than a thermal expansion coefficient of the wiring layer,wherein the semiconductor chip is bonded to the chip mounting surface with face-down.

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