Electromechanical device treatment with water vapor
First Claim
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1. A method for treating an electromechanical device, the method comprising:
- providing an electromechanical device comprising a surface that defines at least a portion of a cavity, the surface being exposed by removing a sacrificial material, wherein the surface comprises one of a metal and a dielectric; and
wherein treating the electromechanical device comprises treating the electromechanical device with water vapor at or below ambient pressure such that surface chemistry of the surface is modified to be less susceptible to stiction, relative to the device without water vapor treatment.
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Abstract
Methods, devices, and systems provide MEMS devices exhibiting at least one of reduced stiction, reduced hydrophilicity, or reduced variability of certain electrical characteristics using MEMS devices treated with water vapor. The treatment is believed to form one or more passivated surfaces on the interior and/or exterior of the MEMS devices. Relatively gentle temperature and pressure conditions ensure modification of surface chemistry without excessive water absorption after removal of sacrificial material to release the MEMS devices.
50 Citations
31 Claims
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1. A method for treating an electromechanical device, the method comprising:
- providing an electromechanical device comprising a surface that defines at least a portion of a cavity, the surface being exposed by removing a sacrificial material, wherein the surface comprises one of a metal and a dielectric; and
wherein treating the electromechanical device comprises treating the electromechanical device with water vapor at or below ambient pressure such that surface chemistry of the surface is modified to be less susceptible to stiction, relative to the device without water vapor treatment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
- providing an electromechanical device comprising a surface that defines at least a portion of a cavity, the surface being exposed by removing a sacrificial material, wherein the surface comprises one of a metal and a dielectric; and
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19. An apparatus comprising a water-vapor passivated MEMS device, wherein the water-vapor passivated MEMS device comprises:
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a first layer comprising a partial reflector; a reflective layer movable relative to the first layer; and a cavity, an interior of which is defined by the first layer and the reflective layer, wherein at least a portion of a surface of the cavity is water-vapor passivated after a sacrificial removal process. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. A method for reducing stiction in a microelectromechanical systems (MEMS) device, the method comprising:
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removing a sacrificial material from a MEMS device; heating the MEMS device after removing the sacrificial material, wherein heating the MEMS device comprises exposing the MEMS device to a maximum temperature lower than approximately 100°
C.; and
exposing and treating the MEMS device with water vapor after heating. - View Dependent Claims (27, 28, 29, 30, 31)
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Specification