Method and apparatus to determine if a pattern is robustly manufacturable

• US 7,739,651 B2
• Filed: 02/28/2007
• Issued: 06/15/2010
• Est. Priority Date: 09/29/2004
• Status: Active Grant

• Current Assignee: Synopsys Incorporated
• Original Assignee: Synopsys Incorporated
• Inventors: Beale, Daniel F., Melvin, Lawrence S. III
• Primary Examiner(s): ROSSOSHEK, YELENA
• Application Number:
  US11/712,805
• Publication Number:
  US 20070162888A1
• Time in Patent Office: 1,203 Days
• Field of Search: 716/1, 716/4, 716/5, 716 19- 21, 430/5
• US Class Current: 716/50
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 1/80 Etching

Abstract

One embodiment provides a method to determine if a pattern is robustly manufacturable. During operation, the system may receive a first pattern and a design intent, wherein the first pattern is intended to generate the design intent. Next, the system may determine a second pattern using the design intent, wherein subjecting the second pattern to a second manufacturing process is expected to generate a third pattern that is substantially similar to the design intent. The system may then determine if a first semiconductor manufacturing process is capable of robustly manufacturing the second pattern. If the second pattern is not robustly manufacturable, the system may generate an indicator that indicates that the first pattern is not robustly manufacturable.

Claims

1. A computer-implemented method for determining if a design intent is robustly manufacturable, the method comprising:

receiving the design intent which is desired to be printed on a wafer using a photolithography process and an etch process;

determining by computer an etch pre-image for the design intent, wherein subjecting the etch pre-image to the etch process is expected to generate the design intent;

determining by computer if the etch pre-image is robustly manufacturable by determining whether a process window at an evaluation point in the etch pre-image is within a desired range, wherein determining the process window includes convolving, at the evaluation point, the etch pre-image with a photolithography sensitivity model which models the sensitivity of the photolithography process to process variations; and

in response to determining that the etch pre-image is not robustly manufacturable, reporting that the design intent is not robustly manufacturable.

2. The method of claim 1, wherein determining the etch pre-image includes applying an inverse-process-model to the design intent which models the inverse of the etch process.

3. The method of claim 1, wherein determining if the etch pre-image is robustly manufacturable includes determining if the etch pre-image is realizable using the photolithography process.

4. A computer-readable storage device storing instructions that when executed by a computer cause the computer to perform a method for determining if a design intent is robustly manufacturable, the method comprising:

receiving the design intent which is desired to be printed on a wafer using a photolithography process and an etch process;

determining an etch pre-image using the design intent, wherein subjecting the etch pre-image to the etch process is expected to generate the design intent;

determining if the etch pre-image is robustly manufacturable by determining whether a process window at an evaluation point in the etch pre-image is within a desired range, wherein determining the process window includes convolving, at the evaluation point, the etch pre-image with a photolithography sensitivity model which models the sensitivity of the photolithography process to process variations; and

in response to determining that the etch pre-image is not robustly manufacturable, reporting that the design intent is not robustly manufacturable.

5. The computer-readable storage device of claim 4, wherein determining the etch pre-image includes applying an inverse-process-model to the design intent which models the inverse of the effect of the etch process.

6. The computer-readable storage device of claim 4, wherein determining if the etch pre-image is robustly manufacturable includes determining if the etch pre-image is realizable using photolithography manufacturing process.

7. An apparatus for determining if a design intent is robustly manufacturable, the apparatus comprising:

a receiving mechanism configured to receive the design intent which is desired to be printed on a wafer using a photolithography process and an etch process;

a first determining mechanism configured to determine an etch pre-image using the design intent, wherein subjecting the etch pre-image to the etch process is expected to generate the design intent;

a second determining mechanism configured to determine if the etch pre-image is robustly manufacturable by determining whether a process window at an evaluation point in the etch pre-image is within a desired range, wherein determining the process window includes convolving, at the evaluation point, the etch pre-image with a photolithography sensitivity model which models the sensitivity of the photolithography process to process variations; and

a reporting mechanism configured to, in response to determining that the etch pre-image is not robustly manufacturable, report that the design intent is not robustly manufacturable.

8. The apparatus of claim 7, wherein the first determining mechanism is configured to apply an inverse-process-model to the design intent which models the etch process.

9. The apparatus of claim 7, wherein the second determining mechanism is configured to determine if the etch pre-image is realizable using the photolithography process.