System and method for direct bonding of substrates
First Claim
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1. A method of forming a MEMS (Micro-Electro-Mechanical System), comprising:
- encasing a plurality of MEMS actuators in a sacrificial material;
forming an ambient port through a MEMS cap which defines a cavity, the cavity containing the plurality of MEMS actuators therein;
removing the sacrificial material using a fluid introduced into the cavity through the ambient port; and
bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
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Abstract
A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port.
24 Citations
20 Claims
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1. A method of forming a MEMS (Micro-Electro-Mechanical System), comprising:
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encasing a plurality of MEMS actuators in a sacrificial material; forming an ambient port through a MEMS cap which defines a cavity, the cavity containing the plurality of MEMS actuators therein; removing the sacrificial material using a fluid introduced into the cavity through the ambient port; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of forming a MEMS (Micro-Electro-Mechanical System), comprising:
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forming an ambient port through a MEMS cap which defines a cavity, the cavity containing a plurality of MEMS actuators therein; introducing an anti-stiction material into the cavity prior to bonding of a lid arrangement to the MEMS cap; bonding the lid arrangement to the MEMS cap to hermetically seal the ambient port; and removing the anti-stiction material from an outboard surface of the MEMS cap during a plasma bonding process executed in connection with the bonding of the lid arrangement to the MEMS cap. - View Dependent Claims (18, 19, 20)
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Specification