Method of clearing electrical contact pads in thin film sealed OLED devices

• US 7,745,340 B2
• Filed: 06/27/2005
• Issued: 06/29/2010
• Est. Priority Date: 06/26/2004
• Status: Expired

• Current Assignee: eMagin Corporation (Samsung Electronics Co. Ltd.)
• Original Assignee: eMagin Corporation (Samsung Electronics Co. Ltd.)
• Inventors: Ghosh, Amalkumar P., Liu, Yachin, Ji, Hua Xia
• Primary Examiner(s): Smith; Matthew
• Assistant Examiner(s): Jefferson; Quovaunda
• Application Number:
  US11/169,154
• Publication Number:
  US 20060051951A1
• Time in Patent Office: 1,828 Days
• Field of Search: 438/57, 438/99, 438/82, 438/612, 438/707, 438/708, 438/780, 438/944, 438/FOR.117, 438/FOR.118, 438/FOR.170, 257/40, 257/642, 257/E39.007, 257/E51.001, 257/E51.013, 257/E51.018, 257/E51.022, 257/E21.523, 257/E21.59
• US Class Current: 438/708
• CPC Class Codes: H01L 21/02098 only involving lasers, e.g. laser ablation
• CPC Class Codes: H01L 21/31127 Etching organic layers
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/8501 Cleaning, e.g. oxide removal step, desmearing
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals

Abstract

A process of cleaning wire bond pads associated with OLED devices, including the steps of depositing on the wire bond pads one or more layers of ablatable material, and ablating the one or more layers with a laser, thereby exposing a clean wire bond pad.

Claims

1. A process of cleaning wire bond pads associated with OLED devices formed on a substrate using a shadow mask wherein the shadow mask has openings adapted to align with the active matrix display region and the wire bond pad region, the method comprising the steps of (a) depositing a conductive layer on a substrate;

(b) placing the shadow mask over the conductive layer;

(c) depositing an organic material layer on the conductive layer through the openings in the shadow mask to form an OLED pattern on the conductive layer in the active matrix display region and cover the wire bond pad region;

(d) removing the shadow mask;

forming a thin film encapsulation layer over substantially the entire surface of the wafer; and

applying a laser beam to the wire bond pad region of the wafer so as to remove the organic material and all layers above same to expose the wire bond pads.