Semiconductor device having a sensor chip, and method for producing the same

• US 7,749,797 B2
• Filed: 08/18/2005
• Issued: 07/06/2010
• Est. Priority Date: 09/07/2004
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Mahler, Joachim, Haimerl, Alfred, Kessler, Angela, Schober, Wolfgang, Bauer, Michael
• Primary Examiner(s): Geyer; Scott B
• Application Number:
  US11/574,861
• Publication Number:
  US 20090026558A1
• Time in Patent Office: 1,783 Days
• Field of Search: None
• US Class Current: 438/64
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8314 Guiding structures outside the body
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/85385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A semiconductor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.

Claims

1. A semiconductor device having a sensor comprising:

a cavity housing;

a sensor chip with a sensor region, the sensor chip being arranged in the cavity of the housing, wherein the cavity housing has an opening to the surroundings, and the sensor region faces the opening; and

wherein the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the housing.

2. The semiconductor device of claim 1, comprising:

wherein the rubber-elastic composition comprises;

a lower region below the sensor chip, on which the rear side of the sensor chip is arranged; and

an upper region, into which edge sides and a top side of the sensor chip with the sensor region are embedded.

3. The semiconductor device of claim 1, comprising wherein the rubber-elastic composition includes an optically transparent elastomer.

4. The semiconductor device of claim 1, comprising wherein the rubber-elastic composition includes silicone rubber.

5. The semiconductor device of claim 1, comprising wherein the sensor chip is electrically connected to external contacts of the semiconductor sensor device via bonding wires and through contacts through the cavity housing.

6. The semiconductor device of claim 1, comprising wherein the cavity housing has a base, which for its part has passage openings.

7. The semiconductor device of claim 1, the cavity housing comprising:

wherein the cavity housing has at least one base and side walls, which delimit the cavity, wherein removable ends of spacers project from the base, which form an abutment for an arrangement and fitting of bonding wires on a sensor chip positioned on the ends of the spacers.

8. The semiconductor device of claim 7, comprising wherein the spacers are pins which project through the base into the cavity.

9. The semiconductor sensor device of claim 7, comprising wherein the ends of the spacers which project from the base are encapsulated by the rubber-elastic composition.

10. A method for producing a semiconductor device comprising:

defining a cavity housing and a sensor chip with sensor region, the sensor chip being arranged in a cavity of the cavity housing;

producing the cavity housing with internal conductor tracks and external contacts and a cavity base, and also side walls surrounding the cavity base, and ends of spacers which project from the cavity base, wherein the arrangement and size of the spacers are adapted to the areal extent of the rear side of a sensor chip such that the ends of the spacers form abutments for an arrangement and fitting of bonding wires on a sensor chip positioned on the ends of the spacers;

filling the base of the cavity of the cavity housing with a rubber-elastic composition at least as far as the ends of the spacers;

applying a sensor chip by its rear side to the ends of the spacers with fixing of the sensor chip on the rubber-elastic composition;

fitting bonding wires on contact areas of the sensor chip;

embedding the bonding wires and the sensor chip into the rubber-elastic composition; and

removing the spacers from the base with formation of passage openings in the base of the cavity housing.

11. The method of claim 10, comprising:

wherein in order to produce a cavity housing with internal conductor tracks and external contacts, producing a lead frame with a plurality of housing positions, wherein the side walls and the base with cast-in spacers in the housing positions are produced by means of injection-molding technology and for this purpose the spacers are positioned in an injection mold prior to the injection molding.

12. The method of claim 10, comprising wherein the lead frame has spacers, which are removed after the injection-molding operation with the lead frame from the completed semiconductor sensor devices.

13. The method of claim 10, comprising wherein the filling of the base of the cavity of the cavity housing with a rubber-elastic composition is effected by using a dispensing technology.

14. The method of claim 10, comprising wherein the fitting of bonding wires on contact areas of the sensor chip is effected by thermocompression or thermosonic bonding.

15. The method of claim 10, comprising wherein the removal of the spacers is effected by using an etching technology.

16. An integrated circuit having a semiconductor device comprising:

a cavity housing;

a sensor arranged in the cavity housing, mechanically decoupled from the cavity housing,

the sensor comprising a sensor chip,

wherein the sensor chip is mechanically decoupled from the cavity housing by being embedded into a rubber-elastic composition in the cavity housing.

17. The integrated circuit of claim 16, comprising:

the sensor chip having a sensor region, wherein the cavity housing has an opening to the surroundings, and the sensor region faces the opening.

18. The integrated circuit of claim 16, comprising:

wherein the rubber-elastic composition comprises;

a lower region below the sensor chip, on which the rear side of the sensor chip is arranged; and

an upper region, into which edge sides and a top side of the sensor chip with the sensor region are embedded.

19. The integrated circuit of claim 16, comprising wherein the rubber-elastic composition includes silicone rubber.

20. The integrated circuit of claim 16, comprising wherein the sensor chip is electrically connected to external contacts of the semiconductor sensor device via bonding wires and through contacts through the cavity housing.

21. The integrated circuit of claim 16, the cavity housing comprising:

wherein the cavity housing has at least one base and side walls, which delimit the cavity, wherein removable ends of spacers project from the base, which form an abutment for an arrangement and fitting of bonding wires on a sensor chip positioned on the ends of the spacers.

22. The integrated circuit of claim 21, comprising wherein the spacers are pins which project through the base into the cavity, wherein the ends of the spacers which project from the base are encapsulated by the rubber-elastic composition.

23. An integrated circuit having a semiconductor device comprising:

a cavity housing;

a sensor arranged in the cavity housing; and

means for mechanically decoupling the sensor from the cavity housing.