Vapor compression circuit and method including a thermoelectric device
First Claim
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1. A method comprising:
- transferring heat from a working fluid flowing through a vapor compression circuit;
generating a flow of heat with a thermoelectric device in heat-transferring relation with said working fluid;
transferring said heat from said working fluid to a first fluid medium;
transferring said heat from said first fluid medium to a second fluid medium,wherein said transferring said heat from said first fluid medium includes transferring said heat to an air flow flowing over at least one of a condenser of a heat pump system downstream of said condenser and an evaporator of a refrigeration system downstream of said evaporator.
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Abstract
A system and method includes a thermoelectric device in heat-transfer relation with a working fluid flowing through a vapor compression circuit. Heat is transferred from the working fluid to a first fluid medium and then from the first fluid medium to a second fluid medium.
331 Citations
26 Claims
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1. A method comprising:
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transferring heat from a working fluid flowing through a vapor compression circuit; generating a flow of heat with a thermoelectric device in heat-transferring relation with said working fluid; transferring said heat from said working fluid to a first fluid medium; transferring said heat from said first fluid medium to a second fluid medium, wherein said transferring said heat from said first fluid medium includes transferring said heat to an air flow flowing over at least one of a condenser of a heat pump system downstream of said condenser and an evaporator of a refrigeration system downstream of said evaporator. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A vapor compression circuit comprising:
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a working fluid; a thermoelectric device in heat-transfer relation with said working fluid; a first fluid medium in heat-transfer relation with said thermoelectric device and receiving heat transferred from said working fluid through said thermoelectric device; a second fluid medium in heat-transfer relation to said first fluid medium; at least one of a condenser and an evaporator, wherein said second fluid medium includes an airflow flowing over at least one of said condenser and said evaporator. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification