Light-emitting diode assembly and method of fabrication

• US 7,753,568 B2
• Filed: 01/23/2007
• Issued: 07/13/2010
• Est. Priority Date: 01/23/2007
• Status: Expired due to Fees

• Current Assignee: Foxconn Technology Co., Ltd.
• Original Assignee: Foxconn Technology Co., Ltd.
• Inventors: Tan, Li-Kuang, Hu, Tseng-Hsiang, Lin, Yeu-Lih
• Primary Examiner(s): Payne; Sharon E
• Application Number:
  US11/626,041
• Publication Number:
  US 20080175008A1
• Time in Patent Office: 1,267 Days
• Field of Search: 362/373, 362/547, 362/218, 362/294, 361/700, 361/707, 257/714, 257/715, 174/15.2, 165/80.4
• US Class Current: 362/373
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/59 with forced flow of the coolant
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.

Claims

1. A light-emitting diode (LED) assembly, comprising:

a heat dissipation device comprising a sealed hollow body in which a working fluid is provided, an outer surface of the sealed hollow body forming a connecting surface having an insulating layer being integrally and directly coated thereon, a circuitry being integrally and directly formed on the insulating layer;

at least one LED die being electrically connected with the circuitry formed on the connecting surface, and being maintained in thermal and mechanical contact with the heat dissipation device to dissipate heat generated thereby through the heat dissipation device; and

a packaging layer encapsulating the at least one LED die, the packaging layer being connected to the insulating layer of the heat dissipation device integrally and directly;

wherein the heat dissipation device is a flat-type heat pipe with two opposite planar-shaped outer surfaces, the heat pipe having an evaporating section and a condensing section formed at two opposite ends thereof, at least one of the two opposite planar-shaped outer surfaces at the evaporating section of the heat pipe forming the connecting surface; and

wherein the LED assembly further comprises a heat sink having a chassis and a plurality of fins extending from a first outer side of the chassis, the chassis defining a groove at a second outer side opposite to the first outer side, the groove having a shape conforming to that of the heat pipe and receiving the heat pipe therein, the at least one of the two opposite planar-shaped outer surfaces which forms the connecting surface being substantially coplanar with the second outer surface of the chassis, and the other one of the two opposite planar-shaped outer surfaces of the heat pipe attaching to the chassis at a bottom of the groove.