LED structure and fabricating method for the same

• US 7,755,282 B2
• Filed: 05/12/2006
• Issued: 07/13/2010
• Est. Priority Date: 05/12/2006
• Status: Active Grant

• Current Assignee: Edison Opto Corporation
• Original Assignee: Edison Opto Corporation
• Inventors: Chen, Pao-Shen, Sun, Tsung-Ting, Chou, Hung-Hsun, Laio, Hung-Ta, Hsu, Kuo-Shih
• Primary Examiner(s): Williams; Joseph L
• Assistant Examiner(s): Quarterman; Kevin
• Application Number:
  US11/383,193
• Publication Number:
  US 20070262713A1
• Time in Patent Office: 1,523 Days
• Field of Search: 313498-512, 257 98-100
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 33/145 Arrangements of the electroluminescent material
• CPC Class Codes: H05B 33/22 characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Abstract

A method is performed for the fabrication of LED and its structure. The LED is capable of emitting uniform white light and includes a substrate, an LED die, a holding frame and fluorescent substance where the holding frame is of hollow shape. The LED contains a die emitting blue light, and the fluorescent substance is a yellow phosphor. As the LED die is mounted on the substrate, the holding frame is seated on the die, and a bond wiring is performed. The holding frame is filled with the fluorescent substance in a uniform distribution on the die to form a layer of fluorescence. Finally the structure of the LED is accomplished as the packaging is completed.

Claims

1. A light emitting diode (LED) structure, comprising:

a substrate having a heat sink with a planar surface;

a light emitting die, mounted on said planar surface of the heat sink, having a concave space located at center thereof and formed by etching a top portion of the light emitting die to a predetermined depth and to expose a light emitting face of the light emitting die, and a wall around the rim thereof, the wall extending from the light emitting die and being formed into one-piece with the light emitting die; and

a fluorescent layer, being formed by filling the concave space with a fluorescent substance, uniformly covering the light emitting face of said light emitting die.

2. An LED structure as in claim 1, wherein said substrate is a semi-finished LED product, the substrate comprises a frame for providing electric conduction, and the substrate is encapsulated to form an encapsulation.

3. An LED structure as in claim 1, wherein said fluorescent layer has a thickness between 20 and 60 um.

4. A light emitting diode (LED) structure, comprising:

a substrate, said substrate having a heat sink, the heat sink having an upwardly-projecting mesa with a planar surface;

a barrier, formed by injecting heat-resisting plastic to cover the upwardly-projecting mesa and part of bottom face of the heat sink, the barrier further comprising upwardly-extended portion to define a hollow space therebetween;

a light emitting die, mounted inside of said hollow space wherein the height of the upwardly-extended portion of the barrier is higher than that of the light emitting die; and

a fluorescent layer, being formed by filling the hollow space with a fluorescent substance, covering top surface of said light emitting die, being exposed from the barrier.

5. An LED structure as in claim 4, wherein the substrate further comprises a frame for providing electric conduction, and the substrate is encapsulated to form an encapsulation extended at least from two lateral sides of the heat sink.

6. An LED structure as in claim 5, wherein the barrier is confined within the encapsulation.

7. An LED structure as in claim 4, wherein the planar surface is exposed from the barrier, the light emitting die is mounted on the planar surface exposed from the barrier so that the barrier embraces the light emitting die, said barrier has a height from the planar surface greater than the thickness of said die, the area of the planar surface exposed from the barrier is either greater than or equal to the area of the light emitting die.

8. An LED structure as in claim 4, wherein said fluorescent layer has a thickness between 20 and 60 um.