Wireless IC device and component for wireless IC device

• US 7,764,928 B2
• Filed: 10/31/2007
• Issued: 07/27/2010
• Est. Priority Date: 01/19/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ishino, Satoshi, Dokai, Yuya, Kato, Noboru
• Primary Examiner(s): Trinh; Sonny
• Application Number:
  US11/930,818
• Publication Number:
  US 20080061983A1
• Time in Patent Office: 1,000 Days
• Field of Search: 455/41.2, 455/41.1, 455/334, 455/39, 455/42, 455/333, 455/327, 455/130, 340/10.1, 340/10.3, 340/10.42, 340/572.1, 340/572.4, 340/572.5, 333/204, 333/219, 333/221, 333/238, 333/246
• US Class Current: 455/41.2
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: Y02D 30/70 : in wireless communication networks

Abstract

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Claims

1. A wireless IC device comprising:

a wireless IC chip;

a circuit board connected to the wireless IC chip, and including a resonant circuit having a predetermined resonant frequency, the resonant circuit being located inside of the circuit board; and

a radiation pattern arranged to perform at least one of radiation of a transmission signal supplied from the resonant circuit, and receipt of a reception signal to be supplied to the resonant circuit;

wherein

at least one of the transmission signal and the reception signal has a frequency substantially equal to the resonant frequency of the resonant circuit.

2. The wireless IC device according to claim 1, wherein the resonant circuit is a concentrated-constant resonant circuit including a capacitor pattern and an inductor pattern defining one of an LC series resonant circuit and an LC parallel resonant circuit.

3. The wireless IC device according to claim 2, wherein the concentrated-constant resonant circuit includes a plurality of the LC series resonant circuits or a plurality of the LC parallel resonant circuits.

4. The wireless IC device according to claim 2, wherein the circuit board is a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are layered, and the capacitor pattern and the inductor pattern are provided on at least one of a surface of and inside of the multilayer board.

5. The wireless IC device according to claim 2, wherein the circuit board is one of a dielectric and a magnetic single-layer board, and at least one of the capacitor pattern and the inductor pattern is provided on the surface of the single-layer board.

6. The wireless IC device according to claim 2, wherein the capacitor pattern is disposed downstream of the wireless IC chip and between the wireless IC chip and the inductor pattern.

7. The wireless IC device according to claim 2, wherein the capacitor pattern and the inductor pattern are disposed substantially in parallel to the radiation pattern.

8. The wireless IC device according to claim 7, wherein at least one of a reflector and wave director is disposed at a portion where a magnetic field is provided by the inductor pattern.

9. The wireless IC device according to claim 1, wherein the circuit board is a rigid board, and the radiation pattern is made of a flexible metal film.

10. The wireless IC device according to claim 1, wherein the wireless IC chip is provided with a chip-side electrode pattern, the circuit board is provided with a board-side electrode pattern, and the wireless IC chip and the circuit board are connected by one of DC connection between the chip-side electrode pattern and the board-side electrode pattern, capacitive coupling between the chip-side electrode pattern and the board-side electrode pattern, and magnetic coupling between the chip-side electrode pattern and the board-side electrode pattern.

11. The wireless IC device according to claim 1, wherein the circuit board is provided with a board-side electrode pattern, and the circuit board and the radiation pattern are connected by one of DC connection between the board-side electrode pattern and the radiation pattern, capacitive coupling between the board-side electrode pattern and the radiation pattern, and magnetic coupling between the board-side electrode pattern and the radiation pattern.

12. The wireless IC device according to claim 1, wherein the circuit board is defined by one of a rigid multilayer board;

a plurality of layered, pressure-bonded, and sintered ceramic sheets, each having a dielectric member; and

a rigid single-layer circuit board made of one of a ceramic and a heat-resistance resin.

13. The wireless IC device according to claim 1, wherein a thickness of the circuit board is about 200 μ

m to about 500 μ

m.

14. The wireless IC device according to claim 1, wherein the resonant circuit is a distributed-constant resonant circuit.

15. The wireless IC device according to claim 1, wherein the electric length of the radiation pattern is an integer multiple of a half wavelength of the resonant frequency.