Semiconductor device and manufacturing method thereof

• US 7,768,405 B2
• Filed: 12/09/2004
• Issued: 08/03/2010
• Est. Priority Date: 12/12/2003
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Akiba, Mai, Koyama, Jun, Yamazaki, Shunpei
• Primary Examiner(s): Previl; Daniel
• Application Number:
  US11/007,257
• Publication Number:
  US 20050130389A1
• Time in Patent Office: 2,063 Days
• Field of Search: 3405721-5729, 340/568.1, 340/539.1, 235/492, 438/153, 438/155, 438/238, 438/280
• US Class Current: 340/572.7
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A semiconductor device typified by a wireless tag, which has improved mechanical strength, can be formed by a more simple process at a low cost and prevent radio waves from being shielded, and a manufacturing method of the semiconductor device. According to the invention, a wireless tag includes a thin film integrated circuit formed of an isolated TFT having a thin film semiconductor film. The wireless tag may be attached directly to an object, or attached to a flexible support such as plastic and paper before being attached to an object. The wireless tag of the invention may include an antenna as well as the thin film integrated circuit. The antenna allows to communicate signals between a reader/writer and the thin film integrated circuit, and to supply a power source voltage from the reader/writer to the thin film integrated circuit.

Claims

1. A semiconductor device comprising a thin film integrated circuit, an antenna, and a substrate, the substrate being flexible,

wherein the thin film integrated circuit comprises a thin film transistor;

wherein the antenna is formed over the substrate;

wherein the thin film transistor is formed over a part of the antenna; and

wherein the thin film integrated circuit is attached to the substrate by an anisotropic conductive resin at a first region overlapping a connecting terminal of the thin film integrated circuit and a connecting terminal of the antenna, and by an insulating resin at a second region overlapping the antenna.

2. The semiconductor device according to claim 1,

wherein the antenna is formed by a droplet ejection method and formed of Ag, Au or Cu.

3. The semiconductor device according to claim 1, further comprising a metal oxide film over the thin film transistor.

4. The semiconductor device according to claim 3, further comprising a protective layer over the metal oxide film.

5. The semiconductor device according to claim 1, wherein the thin film transistor comprises a gate electrode and a semiconductor layer over the gate electrode.

6. The semiconductor device according to claim 1, wherein the thin film transistor comprises a semiconductor layer and a gate electrode over the semiconductor layer.

7. The semiconductor device according to claim 1, the adhesion bond is an anisotropic conductive resin.

8. A manufacturing method of a semiconductor device comprising a thin film integrated circuit and an antenna,

the thin film integrated circuit comprising a thin film transistor;

forming the antenna over a first substrate;

forming the thin film integrated circuit over a second substrate, and

peeling off the thin film integrated circuit from the second substrate by removing the second substrate;

wherein the thin film integrated circuit and the antenna are attached to each other so as to be electrically connected and have a stacked structure,

wherein the thin film integrated circuit is attached to the first substrate by an anisotropic conductive resin at a first region overlapping a connecting terminal of the thin film integrated circuit and a connecting terminal of the antenna, and by an insulating resin at a second region overlapping the antenna.

9. A semiconductor device comprising a thin film integrated circuit, an antenna, and a substrate,

wherein the thin film integrated circuit comprises a thin film transistor;

wherein the substrate is flexible and comprises a first portion, a second portion, and a third portion, the second portion provided between the first portion and the third portion;

wherein the antenna is formed over the first portion of the substrate;

wherein the thin film integrated circuit is attached to the first portion of the substrate so as to be electrically connected to the antenna; and

wherein the substrate is folded so that the thin film integrated circuit is interposed between the first portion and the third portion,

wherein the thin film integrated circuit is attached to the substrate by an anisotropic conductive resin at a first region overlapping a connecting terminal of the thin film integrated circuit and a connecting terminal of the antenna, and by an insulating resin at a second region overlapping the antenna.

10. The semiconductor device according to claim 9, the adhesion bond is an anisotropic conductive resin.

11. The semiconductor device according to claim 9, wherein the antenna is formed by a droplet ejection method and formed of Ag, Au or Cu.

12. A semiconductor device comprising a thin film integrated circuit, an antenna, and a substrate, the substrate being flexible,

wherein the substrate has four sides and three sides of the four sides are closed,

wherein the thin film integrated circuit comprises a thin film transistor;

wherein the antenna is formed in the substrate; and

wherein the thin film integrated circuit is attached inside the substrate by an anisotropic conductive resin at a first region overlapping a connecting terminal of the thin film integrated circuit and a connecting terminal of the antenna, and by an insulating resin at a second region overlapping the antenna.

13. A semiconductor device according to claim 12,

wherein one side of the four sides is open.

14. The semiconductor device according to claim 12, the adhesion bond is an anisotropic conductive resin.

15. The semiconductor device according to claim 12, wherein the antenna is formed by a droplet ejection method and formed of Ag, Au or Cu.

16. A semiconductor device comprising a thin film integrated circuit, an antenna, a first substrate, and a second substrate, the first and second substrates being flexible,

wherein the thin film integrated circuit comprises a thin film transistor;

wherein the antenna is formed over the first substrate;

wherein the thin film transistor is formed over a part of the antenna;

wherein the thin film integrated circuit is attached to the first substrate so as to be electrically connected to the antenna;

wherein the second substrate is stacked over the first substrate so that the antenna and the thin film integrated circuit are interposed therebetween, and

wherein the thin film integrated circuit is attached to the first substrate by an anisotropic conductive resin at a first region overlapping a connecting terminal of the thin film integrated circuit and a connecting terminal of the antenna, and by an insulating resin at a second region overlapping the antenna.

17. The semiconductor device according to claim 16,

wherein the second substrate is a protective layer,

wherein an oxide film and a metal oxide film are interposed between the thin film transistor and protective layer.

18. The semiconductor device according to claim 16,

wherein the thin film integrated circuit is connected to the antenna via an anisotropic conductive resin.

19. The paper according to claim 18,

wherein the antenna is formed by a droplet ejection method and formed of Ag, Au or Cu.

20. The semiconductor device according to claim 16, wherein the antenna is formed by a droplet ejection method and formed of Ag, Au or Cu.

21. A semiconductor device comprising a thin film integrated circuit, a first antenna, a second antenna, a first substrate, and a second substrate, the first and second substrates being flexible,

wherein the thin film integrated circuit comprises a thin film transistor;

wherein the first antenna is formed over the first substrate;

wherein the second antenna is formed over the second substrate;

wherein the thin film integrated circuit is attached to the first substrate so as to be electrically connected to the first antenna; and

wherein the second substrate is stacked over the first substrate so that the first antenna is electrically connected to the second antenna, and

wherein the second substrate is stacked over the first substrate so that the first antenna, the second antenna and the thin film integrated circuit are interposed between the first substrate and the second substrate.

22. The semiconductor device according to claim 21,

wherein the first antenna or the second antenna is formed by a droplet ejection method and formed of Ag, Au or Cu.

23. The semiconductor device according to claim 21, the adhesion bond is an anisotropic conductive resin.

24. A semiconductor device comprising a thin film integrated circuit comprising a thin film transistor,

wherein the thin film integrated circuit comprises a connecting terminal;

and

wherein the thin film integrated circuit comprises a rectification circuit for generating a DC power source voltage from an AC signal inputted to the connecting terminal by an antenna, a demodulation circuit for demodulating the AC signal to generate a first signal, a microprocessor for performing a processing in accordance with the first signal to generate a second signal, a modulation circuit for modulating the second signal, and a switch for modulating a load applied to the antenna in accordance with the modulated second signal,

wherein the antenna is formed over the substrate;

wherein the thin film transistor is formed over a part of the antenna; and

wherein the thin film integrated circuit is attached to the substrate so as to be electrically connected to the antenna.

25. A manufacturing method of a semiconductor device comprising a thin film integrated circuit comprising a thin film transistor,

wherein the thin film integrated circuit comprises a connecting terminal;

wherein the thin film integrated circuit comprises a rectification circuit for generating a DC power source voltage from an AC signal inputted to the connecting terminal by an antenna, a demodulation circuit for demodulating the AC signal to generate a first signal, a microprocessor for performing a processing in accordance with the first signal to generate a second signal, a modulation circuit for modulating the second signal, and a switch for modulating a load applied to the antenna in accordance with the modulated second signal;

forming the thin film integrated circuit over a substrate, and

peeling off the thin film integrated circuit from the substrate by removing the substrate.

26. A paper having a semiconductor device,

wherein the semiconductor device comprises a thin film integrated circuit, an antenna, and a substrate, the substrate being flexible,

wherein the thin film integrated circuit comprises a thin film transistor;

wherein the antenna is formed over the substrate;

wherein the thin film transistor is formed over a part of the antenna; and

wherein the thin film Integrated circuit is attached to the substrate by an anisotropic conductive resin at a first region overlapping a connecting terminal of the thin film integrated circuit and a connecting terminal of the antenna, and by an insulating resin at a second region overlapping the antenna.

27. The semiconductor device according to claim 26, the adhesion bond is an anisotropic conductive resin.