Systems, devices, and methods for semiconductor device temperature management

• US 7,781,263 B2
• Filed: 06/08/2009
• Issued: 08/24/2010
• Est. Priority Date: 06/06/2008
• Status: Expired due to Fees

• Current Assignee: Coolsilicon, LLC
• Original Assignee: Coolsilicon, LLC
• Inventors: Zeyen, Benedikt, Winter, Bradley J.
• Primary Examiner(s): Garber; Charles D
• Assistant Examiner(s): Lee; Cheung
• Application Number:
  US12/480,652
• Publication Number:
  US 20090305482A1
• Time in Patent Office: 442 Days
• Field of Search: 438/42, 438/55, 438/422, 257/E21.501, 257/E21.512, 156/144
• US Class Current: 438/122
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 27/0211 adapted for requirements of temperature
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes a semiconductor die formed of integral device layers and further includes at least one coolant reservoir and at least one coolant channel. In an embodiment, the at least one coolant reservoir and at least one coolant channel are disposed wholly within the semiconductor die. In various embodiments, at least one coolant reservoir and at least one coolant channel are constructed and arranged to circulate coolant fluid in proximity to at least one IC device structure in order to decrease and or normalize an operating temperature of the IC device. In other embodiments, systems and methods for designing and/or fabricating IC die that include at least one intra-die cooling structure are provided herein.

Claims

1. A method of fabricating an IC die that includes at least one coolant fluid reservoir, comprising:

providing a first substrate layer that includes a first surface and a second surface;

defining at least one recess in said second surface;

filling said at least one recess with a structural material to form at least one reservoir pillar;

etching said first surface to expose said at least one reservoir pillar at said second surface;

etching at said first surface, at least one region adjacent to said at least one reservoir pillar, to form at least one coolant housing portion; and

bonding at least one of said first surface or said second surface to at least one other layer of said IC die.

2. The method of claim 1, further comprising:

forming, at said second surface, at least one heat sink.

3. The method of claim 2, wherein forming, at said second surface, at least one heat sink includes using a sputtering process.

4. The method of claim 3, wherein said forming at least one heat sink includes sputtering a TI/Au layer stack on said second surface and using a copper electroplating process.

5. The method of claim 1, further comprising:

forming at least one coolant inlet in said coolant reservoir.