Disk drive suspension via formation using a tie layer and product

  • US 7,781,679 B1
  • Filed: 01/26/2006
  • Issued: 08/24/2010
  • Est. Priority Date: 09/09/2005
  • Status: Active Grant
First Claim
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1. A disk drive suspension interconnect comprising a stainless steel grounding layer, a synthetic organic polymer layer on the stainless steel grounding layer, the synthetic organic polymer layer having an aperture therethrough, the synthetic organic polymer layer having walls defining the aperture therethrough, the organic polymer layer walls having wall slopes of less than 90 degrees, a chromium layer sputtered directly onto the stainless steel grounding layer within the aperture for facilitating an electrical contact to the stainless steel grounding layer within the aperture, a metal conductive layer bonded to the sputtered chromium layer within the aperture, an electrodeposited copper layer on the synthetic organic polymer layer and the metal conductive layer, and a circuit component electrically connected to the electrodeposited copper layer, the sputtered chromium layer and the metal conductive layer being disposed at least partially within the aperture of the synthetic organic polymer layer, the aperture being substantially filled with metal without the need for conductive adhesive within the aperture, the chromium layer and the metal conductive layer and the electrodeposited copper layer together providing an electrical ground path from the electrical component to the stainless steel grounding layer thereby grounding the electrical component to the stainless steel grounding layer.

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