Low-loss interface

• US 7,782,156 B2
• Filed: 09/11/2007
• Issued: 08/24/2010
• Est. Priority Date: 09/11/2007
• Status: Active Grant

• Current Assignee: ViaSat Incorporated
• Original Assignee: ViaSat Incorporated
• Inventors: Filreis, Jon, Cook, Dean, Woods, Charles, Lopez, Noel
• Primary Examiner(s): Jones; Stephen E
• Application Number:
  US11/853,287
• Publication Number:
  US 20090066441A1
• Time in Patent Office: 1,078 Days
• Field of Search: 333/34, 333/33, 333/254, 333/260, 333/26
• US Class Current: 333/34
• CPC Class Codes: H01L 2223/6633 Transition between different waveguide types
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19039 impedance transition between different types of wave guides
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions

Abstract

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Claims

1. An electronic system comprising:

a monolithic microwave integrated circuit with a first impedance and a first mode of energy wave propagation;

a second energy transmission device with a second impedance and a second mode of energy wave propagation;

a step launch interface connecting the monolithic microwave integrated circuit and the second energy transmission device and configured to transport energy from the monolithic microwave integrated circuit to the second energy transmission device with minimal loss by matching the first impedance and first mode of energy wave propagation to the second impedance and second mode of energy wave propagation by performing impedance and mode transition without the use of dielectric material; and

wherein the system does not include a separate microstrip between the step launch and the monolithic microwave integrated circuit.

2. The electronic system of claim 1, wherein the step launch interface is constructed of an electrically conductive material.

3. The electronic system of claim 1, wherein the second energy transmission device is a waveguide.

4. The electronic system according to claim 3, wherein the monolithic microwave integrated circuit is connected to the step launch interface by a wirebond.

5. The electronic system of claim 3, wherein the monolithic microwave integrated circuit is connected to the step launch interface by a ribbon bond.

6. The electronic system of claim 3, wherein the monolithic microwave integrated circuit is connected to the step launch interface by a spongy material.

7. An electronic system comprising:

a monolithic microwave integrated circuit;

a step launch connected to the monolithic microwave integrated circuit on a first end of the step launch, wherein the step launch is configured to match the impedance of the monolithic microwave integrated circuit at the first end; and

a waveguide connected to a second end of the step launch, the second end of the step launch opposing the first end of the step launch, wherein the second end of the step launch is configured to match the impedance of the waveguide;

wherein the electronic system does not include a separate microstrip or dielectric material between the step launch and the monolithic microwave integrated circuit.

8. The electronic system of claim 7, further comprising a compressible structure that connects the step launch to the monolithic microwave integrated circuit.

9. The electronic system of claim 7, wherein the step launch comprises a sloped transition.

10. The interface of claim 7, wherein the step launch comprises a cavity in the step launch, wherein the cavity is smaller at the first end than at the second end, and wherein the cavity increases in size from the first end to the second end.

11. The electronic system of claim 7, further comprising a pin that connects the step launch to the monolithic microwave integrated circuit.

12. The electronic system of claim 11, wherein the pin is a spring.

13. The electronic system of claim 7, wherein the step launch comprises a stepped transition.

14. The electronic system of claim 13, wherein the stepped transition comprises a first ridge and a second ridge.

15. An interface comprising:

a tension absorbing interface pin with a first impedance;

a monolithic microwave integrated circuit in direct communication with the tension absorbing interface pin without a separate microstrip between the monolithic microwave integrated circuit and tension absorbing interface pin; and

a waveguide step launch connected to the interface pin and a waveguide, wherein the waveguide step launch comprises a stepped transition and a variable ridge height that enables the waveguide step launch to have at least two impedances, and wherein the impedance at a connection point to the tension absorbing interface pin is equal to the first impedance and the opposing end of the waveguide step launch has a second impedance.

16. (Previously Withdrawn) The interface of claim 15, wherein the tension absorbing interface pin is a spongy, conductive material.

17. The interface of claim 15, wherein the tension absorbing interface pin is wire bonded to the waveguide step launch.

18. The interface of claim 15, wherein the tension absorbing interface pin is attached to an underside of the waveguide step launch.

19. The interface of claim 15, wherein the tension absorbing interface pin is a spring.

20. The interface of claim 15, wherein the second impedance matches the impedance of a waveguide.

21. The interface of claim 20, wherein the waveguide step launch is connected to a waveguide at the opposing end with the second impedance.

22. A pathway for microwaves comprising:

a monolithic microwave integrated circuit with a first impedance;

a wirebond with opposing ends wherein the wirebond is_directly connected to the monolithic microwave integrated circuit on one end and an interface on the opposing end;

the interface having the first impedance at the first end and a second impedance at a second end, the interface further connected to a waveguide at the second end, wherein the waveguide has a second impedance; and

the interface further comprising a cavity, wherein the cavity has a different size at different points along the direction of the microwave pathway, and wherein the size of the cavity increases at different points along the direction of the microwave pathway.

23. The pathway of claim 22, wherein the waveguide step launch comprises a sloped transition.

24. The pathway of claim 22, wherein the interface further comprises a waveguide step launch comprising a stepped transition.

25. The pathway of claim 24, wherein the stepped transition comprises a first ridge and a second ridge.

26. An electronic system comprising:

a monolithic microwave integrated circuit with a first impedance and a first mode of energy wave propagation;

a waveguide with a second impedance and a second mode of energy wave propagation;

a step launch interface connecting the monolithic microwave integrated circuit and the waveguide and configured to transport energy from the monolithic microwave integrated circuit to the waveguide with minimal loss by matching the first impedance and first mode of energy wave propagation to the second impedance and second mode of energy wave propagation by performing impedance and mode transition without the use of dielectric material; and

wherein the system does not include a separate microstrip between the step launch and the monolithic microwave integrated circuit.

27. The electronic system according to claim 26, wherein the monolithic microwave integrated circuit is connected to the step launch interface by a wirebond.

28. The electronic system of claim 26, wherein the monolithic microwave integrated circuit is connected to the step launch interface by a ribbon bond.