Electronic device and cooling system thereof

• US 7,782,615 B1
• Filed: 06/23/2009
• Issued: 08/24/2010
• Est. Priority Date: 03/26/2009
• Status: Expired due to Fees

• Current Assignee: Cloud Network Technology Singapore Pte. Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Hao-Der, Cheng, Chan, Hung-Chou
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US12/489,454
• Time in Patent Office: 427 Days
• Field of Search: None
• US Class Current: 361/695
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Abstract

An electronic device with a cooling system includes an enclosure. A first electronic component and a second electronic component in parallel are received in the enclosure. Air inlets are defined in a front board of the enclosure to receive cool air. A first flow of the cool air passes through a main airflow path to cool the first electronic component and the second electronic component. A second flow of the cool air passes through an auxiliary airflow path to cool the second electronic component. The main airflow path and the auxiliary airflow path are separated by a clapboard. The cool air heated by the first and second electronic components is then exhausted through the air outlets defined in a back board of the enclosure.

Claims

1. An electronic device, comprising:

a first electronic component;

a second electronic component;

an enclosure to receive the first and second electronic components, wherein the enclosure defines a plurality of air inlets to receive cool air to cool the first and second electronic components; and

a plurality of air outlets to exhaust the cool air heated by the first and second electronic components, wherein the first electronic component is adjacent to the plurality of air inlets, and the second electronic component is aligned with the first electronic component, and adjacent to the plurality of air outlets;

a main airflow path defined in the enclosure and along a side of the first electronic component and the second electronic component, to allow a first flow of the cool air pass through the enclosure to cool the first electronic component and the second electronic component in turn;

a first clapboard;

an auxiliary airflow path defined in the enclosure and adjacent to the main airflow path, to allow a second flow of the cool air pass through the enclosure to cool the second electronic component;

wherein the auxiliary airflow path is separated from the main airflow path by the first clapboard, and communicates with the main airflow path between the first electronic component and the second electronic component; and

at least one fan to blow the cool air passing through the enclosure out of the enclosure via the plurality of air outlets.

2. The electronic device of claim 1, wherein the enclosure includes a front board and a back board opposite to the front board;

wherein the plurality of air inlets are defined in the front board, and the plurality of air outlets are defined in the back board.

3. The electronic device of claim 1, wherein the enclosure comprises a board module;

the first clapboard is located in the board module and adjacent to the plurality of air inlets;

the main airflow path is defined between the board module and the second electronic component, and further extends between the first clapboard and the first electronic component;

the auxiliary airflow path is defined between the first clapboard and the board module.

4. The electronic device of claim 3, wherein the board module of the enclosure comprises a top board, a bottom board parallel to the top board, and a second clapboard arranged between and parallel to the top board and the bottom board.

5. The electronic device of claim 1, wherein the auxiliary airflow path comprises an opening in an end adjacent to the main airflow path of the auxiliary airflow path, to communicate with the main airflow path.

6. The electronic device of claim 1, wherein a width of the main airflow path is about 1 mm-5 mm.

7. The electronic device of claim 1, wherein a width of the auxiliary airflow path is about 1 mm-5 mm.

8. A cooling system, comprising:

an enclosure defining an air inlet to receive cool air to cool electronic components arranged in the enclosure, and an air outlet to exhaust the cool air heated by the electronic components out of the enclosure;

a main airflow path defined in the enclosure, and extending from the air inlet to the air outlet, to allow a first flow of the cool air from the air inlet pass through the enclosure and exhaust via the air outlet; and

an auxiliary airflow path defined in the enclosure, and extending from the air inlet towards the air outlet, wherein a first end of the auxiliary airflow path is communicated with the air inlet, a second end of the auxiliary airflow path is communicated with a rear segment adjacent to the air outlet of the main airflow path, to allow a second flow of the cool air from the air inlet pass through the auxiliary airflow path then enter into the rear segment of main airflow path.

9. The cooling system of claim 8, wherein the enclosure includes a front board and a back board;

wherein the air inlet is defined in the front board, and the air outlet is defined in the back board.

10. The cooling system of claim 8, further comprising a first clapboard to separate a front segment adjacent to the air inlet of the main airflow path from the auxiliary airflow path.

11. The cooling system of claim 10, wherein the enclosure comprises a top board, a bottom board parallel to the top board, and a second clapboard between and parallel to the top board and the bottom board.

12. The cooling system of claim 8, wherein a width of the main airflow path is about 1 mm-5 mm.

13. The cooling system of claim 8, wherein a width of the auxiliary airflow path is about 1 mm-5 mm.