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Integrated MEMS 3D multi-sensor

  • US 7,784,344 B2
  • Filed: 11/29/2007
  • Issued: 08/31/2010
  • Est. Priority Date: 11/29/2007
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a first capacitive bridge sensor having a first proof mass supported by a first set of springs to permit movement in a first axis and a first comb capacitive structure responsive to movement of the first proof mass and responsive to magnetic fields; and

    a second capacitive bridge sensor having a second proof mass located within the first proof mass, the second proof mass supported by a second set of springs to permit movement in a second axis and a second comb capacitive structure responsive to movement of the first proof mass and responsive to magnetic fields, wherein the first and second comb structures are adapted to utilize differential sidewall capacitive sensing for both movement of the proof masses and magnetic fields.

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