Human-readable, bi-state environmental sensors based on micro-mechanical membranes

• US 7,787,171 B2
• Filed: 03/31/2008
• Issued: 08/31/2010
• Est. Priority Date: 03/31/2008
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Webster, James Randolph
• Primary Examiner(s): Thompson; Timothy J
• Application Number:
  US12/060,041
• Publication Number:
  US 20090244680A1
• Time in Patent Office: 883 Days
• Field of Search: 359/238, 359/290, 359/291, 340/665, 340/666, 340/669, 340/689
• US Class Current: 359/291
• CPC Class Codes: G01D 1/18 with arrangements for signalling that a predetermined value of an unspecified parameter has been exceeded G01D1/14 takes precedence
• CPC Class Codes: G01D 5/26 characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
• CPC Class Codes: G01D 9/00 Recording measured values
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

An environmental sensing device includes an interferometric modulator which permanently actuates, in a visually-detectable manner, in response to being exposed to a predetermined environmental threshold or condition. The device can include a reactive layer, coating, or proof mass disposed on a movable member of the interferometric modulator. The reactive layer, coating, or proof mass can expand, contract, bend, or otherwise move when exposed to a predefined chemical, level of humidity, temperature threshold, type of radiation, and/or level of mechanical shock, causing the interferometric modulator to collapse and permanently indicate such exposure.

Claims

1. A sensor, comprising:

an interferometric modulator, the modulator configured to permanently actuate in response to a predetermined level of mechanical shock, wherein the actuation of the interferometric modulator is visually detectable, wherein said actuation occurs without requiring application of a voltage across the interferometric modulator.

2. The sensor of claim 1, wherein the interferometric modulator comprises a proof mass configured to cause said actuation in response to said level of mechanical shock.

3. A sensor comprising:

an interferometric modulator, the modulator configured to permanently actuate in response to a predetermined level of mechanical shock, wherein the actuation of the interferometric modulator is visually detectable, wherein the interferometric modulator comprises a proof mass configured to cause said actuation in response to said level of mechanical shock, and wherein the interferometric modulator comprises an optical stack and a movable layer, said proof mass being attached to the movable layer.

4. A sensor comprising:

an interferometric modulator, the modulator configured to permanently actuate in response to a predetermined level of mechanical shock, wherein the actuation of the interferometric modulator is visually detectable; and

a package configured to seal an internal environment of the interferometric modulator from an external environment, the internal environment being configured to prevent permanent actuation of the modulator, the package comprising at least one removable portion configured to expose the internal environment to the external environment upon removal to activate said sensor.

5. A sensor comprising:

means for interferometrically modulating light; and

means for inducing permanent actuation of the light modulating means in response to a predetermined level of mechanical shock, wherein said actuation occurs without requiring application of a voltage across the light modulating means.

6. The sensor of claim 5, wherein the inducing means comprises a proof mass configured to cause said actuation in response to said level of mechanical shock.

7. The sensor of claim 5, further comprising means for activating the inducing means.

8. A sensor comprising:

means for interferometrically modulating light;

means for inducing permanent actuation of the light modulating means in response to a predetermined level of mechanical shock; and

means for activating the inducing means, wherein the activating means comprises a removable sealing layer disposed on the light modulating means.

9. A method of manufacturing an interferometric modulator, the method comprising:

providing a proof mass on a movable member of the interferometric modulator, the proof mass being configured to cause the interferometric modulator to collapse when exposed to a predetermined level of mechanical shock; and

treating the movable member or an optical stack of the interferometric modulator so as to ensure that adhesion will be permanent upon collapse.

10. The method of claim 9, wherein said treating comprises driving charge into a surface dielectric film of the optical stack.

11. The method of claim 9, wherein said treating comprises roughening a contact surface of at least one of the movable member or the optical stack.

12. The method of claim 9, wherein said treating comprises coating a contact surface of at least one of the movable member or the optical stack with an adhesive.

13. A method of indicating exposure to an environmental stimulus, the method comprising:

providing an interferometric modulator having a proof mass disposed on a movable member of the interferometric modulator, the proof mass being configured to cause the interferometric modulator to collapse when exposed to a predetermined level of shock, the interferometric modulator being configured to ensure that said collapse is permanent.