Method for producing a broadband antenna

• US 7,788,793 B2
• Filed: 12/02/2005
• Issued: 09/07/2010
• Est. Priority Date: 09/16/2003
• Status: Active Grant

• Current Assignee: NIITEK, Inc.
• Original Assignee: NIITEK, Inc.
• Inventors: Wichmann, Gunter
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US11/292,433
• Publication Number:
  US 20080092364A1
• Time in Patent Office: 1,740 Days
• Field of Search: 296/00, 296/021, 29830-834, 29593-594, 343/895, 343/702, 343/900, 455/575.1, 455/575.7, 455/558, 455/90, 340/572.1, 342/22, 342/27, 342/195
• US Class Current: 29/600
• CPC Class Codes: G01S 13/04 Systems determining presence of a target based on relative movement of target G01S13/56
• CPC Class Codes: G01S 13/885 for ground probing prospecting or detecting using electromagnetic waves G01V3/12
• CPC Class Codes: G01S 13/888 through wall detection
• CPC Class Codes: G01V 3/12 operating with electromagnetic waves operating with millimetre waves G01V8/005
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

A method for manufacturing a broadband antenna, such as applicable for a low radar cross-section ground penetrating radar. A conductive film is deposited along a dielectric member, such as by sputtering, in such a manner that the impedance of the conducting film is a continuous function of length along the dielectric member. A sampling circuit is then coupled electrically to the feedpoint.

Claims

1. A method for manufacturing a broadband antenna and sampling circuit arrangement, the method comprising:

a. depositing a conductive film characterized by a resistive impedance along a dielectric member in such a manner that the resistive impedance of the conducting film is a continuous and increasing function of length along the dielectric in each arm of two arms of a vee, as measured from a feedpoint that is located where the arms of the vee are closest to each other; and

b. disposing the sampling circuit at the feedpoint of the vee and electrically coupling the sampling circuit to the conducting film at the feedpoint of the vee.

2. The method in accordance with claim 1, wherein the step of depositing a conductive film includes sputtering a resistive layer of a conducting metal.

3. The method in accordance with claim 1, wherein the step of depositing a conductive film includes depositing a conductive film in such a manner that the impedance of the conductive film increases substantially linearly with length along the dielectric member.