Apparatus including processor

• US 7,804,688 B2
• Filed: 07/27/2009
• Issued: 09/28/2010
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): Datskovskiy; Michael V
• Application Number:
  US12/509,644
• Publication Number:
  US 20090284913A1
• Time in Patent Office: 428 Days
• Field of Search: 361/679.46, 361/679.54, 361/690, 361/692, 361702-712, 361714-721, 361/732, 361/737, 361/803, 361/816, 361/818, 165/80.2, 165/80.3, 165/80.4, 165/104.33, 165/185, 257706-727, 174/15.1, 174/16.3, 174/252, 174/50, 174/50.52, 174/50.54
• US Class Current: 361/714
• CPC Class Codes: H04L 1/0083 Formatting with frames or packets; Protocol or part of protocol for error control
• CPC Class Codes: H04L 65/61 for supporting one-way streaming services, e.g. Internet radio
• CPC Class Codes: H04L 65/70 Media network packetisation
• CPC Class Codes: H04L 65/80 Responding to QoS

Abstract

An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board.

Claims

1. An apparatus comprising:

a processor comprising a major surface, wherein said processor generates heat when energized;

a heat dissipation plate comprising a thermally conductive material, and including a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion, wherein the heat dissipation plate is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate; and

a heat dissipating material contacting the heat dissipation plate and the major surface of the processor, wherein the heat dissipating material does not contact the second portion of the heat dissipating plate,

wherein the pins are configured to be received in a socket assembly on a circuit board.

2. The apparatus of claim 1 further comprising a biasing element operatively coupled to the processor.

3. The apparatus of claim 1 wherein the processor is a microprocessor.

4. The apparatus of claim 1 wherein the heat dissipation plate comprises aluminum.

5. The apparatus of claim 1 wherein the processor is a RISC type processor.

6. The apparatus of claim 1 wherein the processor operates at a frequency of 25 MHz or more.

7. The apparatus of claim 1 further comprising a housing comprising air passages enclosing the processor.

8. The apparatus of claim 1 further comprising a conductive structure around the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

9. The apparatus of claim 1 further comprising a conductive structure around the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is configured to be grounded to the circuit board.

10. The apparatus of claim 1 wherein the pins are only at a peripheral region of the processor.

11. The apparatus of claim 10 wherein the heat dissipating material comprises a material with a thermal conductance rate of 1 W/m·

K or more.

12. The apparatus of claim 1 wherein the heat dissipating material comprises a material with a thermal conductance rate of 1 W/m·

K or more.

13. The apparatus of claim 12 wherein the heat dissipation plate comprises aluminum.