Insulated spray cooling system for extreme environments

• US 7,806,166 B1
• Filed: 12/15/2005
• Issued: 10/05/2010
• Est. Priority Date: 02/18/2003
• Status: Active Grant

• Current Assignee: Parker Intangibles LLC (Parker-Hannifin Corporation)
• Original Assignee: Parker-Hannifin Corporation
• Inventors: Miller, Douglas W., Beasley, William J., Tilton, Charles L., Palmer, Randall T.
• Primary Examiner(s): Walberg; Teresa J
• Application Number:
  US11/303,864
• Time in Patent Office: 1,755 Days
• Field of Search: 165/58, 165/80.2, 165/80.4, 165/80.5, 165/104.21, 165/104.22, 165/104.25, 165/104.33, 361/700, 174/547, 174/548, 174/DIG.34, 220/592.09, 220/592.2, 220/62.11, 220/62.18, 220/62.19, 220/62.22, 220/DIG.9
• US Class Current: 165/58
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An insulated spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The insulated spray cooling system for extreme environments includes an insulated enclosure that isolates the electronic devices being thermally managed from the external environment and a thermal management unit within the enclosure for thermally managing electronic devices.

Claims

1. An insulated enclosure for thermally managing at least one electronic device, comprising:

an enclosure comprised of an outer wall and an inner wall positioned within said outer wall, wherein said inner wall defines an interior cavity, wherein said enclosure is positioned within an extreme external temperature environment;

wherein said inner wall is flexible and resilient that allows for the expansion and contraction of said inner wall dependent upon the pressure within said interior cavity;

a layer of insulation between said inner wall and said outer wall, wherein said layer of insulation completely surrounds said inner wall; and

a thermal management unit within said interior cavity of said enclosure thermally managing at least one electronic device, wherein said thermal management unit is comprised of a spray unit that sprays a liquid coolant upon said at least one electronic device.

2. The insulated enclosure of claim 1, wherein said layer of insulation is attached to both said inner wall and said outer wall.

3. The insulated enclosure of claim 1, wherein said layer of insulation is comprised of fiber, plastic, acrylic, epoxy, an insulating gas, reinforced ceramics or a vacuum.

4. The insulated enclosure of claim 1, wherein said layer of insulation is comprised of a vacuum and a honeycomb reinforcing wall.

5. The insulated enclosure of claim 1, wherein said layer of insulation is comprised of a composite material.

6. The insulated enclosure of claim 5, wherein said layer of insulation is comprised of plastic and fiberglass.

7. The insulated enclosure of claim 5, wherein said layer of insulation is comprised of plastic and carbon fiber.

8. The insulated enclosure of claim 5, wherein said layer of insulation is comprised of plastic and graphite fiber.

9. The insulated enclosure of claim 1, wherein said layer of insulation has a thermal conductivity less than aluminum.

10. The insulated enclosure of claim 1, wherein said layer of insulation is comprised of an insulating fluid.

11. An insulated enclosure for thermally managing at least one electronic device, comprising:

an enclosure defining an interior cavity, wherein said enclosure is positioned within an extreme external temperature environment;

a layer of insulation attached to said enclosure, wherein said layer of insulation completely surrounds said interior cavity, wherein at least a portion of said layer of insulation is movable with respect to said enclosure to adjust the spacing between said layer of insulation and said enclosure; and

a thermal management unit within said interior cavity of said enclosure thermally managing at least one electronic device, wherein said thermal management unit is comprised of a spray unit that sprays a liquid coolant upon said at least one electronic device.

12. The insulated enclosure of claim 11, wherein said layer of insulation is attached to substantially an entire inner surface of said enclosure.

13. The insulated enclosure of claim 11, wherein said layer of insulation is attached to a portion of an entire inner surface of said enclosure.

14. The insulated enclosure of claim 11, wherein said layer of insulation is comprised of fiber, plastic, acrylic or epoxy.

15. The insulated enclosure of claim 11, wherein said layer of insulation is comprised of a composite material.

16. The insulated enclosure of claim 15, wherein said layer of insulation is comprised of plastic and fiberglass.

17. The insulated enclosure of claim 15, wherein said layer of insulation is comprised of plastic and carbon fiber.

18. The insulated enclosure of claim 15, wherein said layer of insulation is comprised of plastic and graphite fiber.

19. The insulated enclosure of claim 11, wherein said layer of insulation has a thermal conductivity less than aluminum.

20. The insulated enclosure of claim 11, including at least one actuator connected to said layer of insulation to selectively move said insulation.

21. The insulated enclosure of claim 11, wherein at least a portion of said layer of insulation is slidable with respect to said enclosure.

22. The insulated enclosure of claim 11, wherein at least a portion of said layer of insulation is foldable with respect to said enclosure.

23. The insulated enclosure of claim 11, wherein said layer of insulation is comprised of a flexible material, and wherein said layer of insulation is retractable into and extendable from a storage unit.

24. An insulated enclosure for thermally managing at least one electronic device, comprising:

an enclosure comprised of an outer wall and an inner wall positioned within said outer wall, wherein said inner wall defines an interior cavity, wherein said enclosure is positioned within an extreme external temperature environment;

a thermal management unit within said interior cavity of said enclosure thermally managing at least one electronic device, wherein said thermal management unit is comprised of a spray unit that sprays a liquid coolant upon said at least one electronic device;

a first cavity between at least a portion of said inner wall and said outer wall; and

a pump fluidly connected to said first cavity to automatically input or remove an insulating fluid with respect to said first cavity during use.

25. The insulated enclosure of claim 24, wherein said insulating fluid is comprised of an insulating gas.

26. The insulated enclosure of claim 25, wherein said insulating gas has a thermal conductivity less than aluminum.

27. The insulated enclosure of claim 24, wherein said insulating fluid is comprised of an insulating liquid.

28. The insulated enclosure of claim 25, wherein said insulating liquid has a thermal conductivity less than aluminum.

29. The insulated enclosure of claim 24, wherein said pump creates a vacuum within said first cavity.