Solid state lighting component

• US 7,821,023 B2
• Filed: 05/23/2008
• Issued: 10/26/2010
• Est. Priority Date: 01/10/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald, Ibbetson, James, Keller, Bernd, Tarsa, Eric, Yuan, Thomas
• Primary Examiner(s): Dang; Phuc T
• Application Number:
  US12/154,691
• Publication Number:
  US 20090050907A1
• Time in Patent Office: 886 Days
• Field of Search: 257/80, 257/88, 257/98
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05B 45/20 Controlling the colour of the light
• CPC Class Codes: H05B 45/40 Details of LED load circuits

Abstract

An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Claims

1. A monolithic white light emitting diode (LED) package, comprising:

single or multiple color LED chip array generating greater than approximately 800 lumens at less than approximately 3000 K, said LED chip array arranged on a substantially planar substrate with a single overmolded lens; and

integrated thermal spreading structures.

2. The LED package of claim 1, emitting a white light from the combined emission of LED chips in said LED chip array.

3. The LED package of claim 1, wherein said lens is in direct contact with said LED chip array.

4. The LED package of claim 1, wherein said thermal spreading structures comprise thermally conductive traces on said substrate.

5. The LED package of claim 1, wherein said thermal spreading structures comprise die attach pads on said substrate.

6. The LED package of claim 1, wherein said thermal spreading structures comprise an electrically neutral thermally conductive pad.

7. The LED package of claim 6, wherein said electrically neutral pad is on a surface of said substrate opposite said LED chip array.

8. The LED package of claim 1, wherein said thermal spreading structures comprise thermal spreading layers within said substrate.

9. The LED package of claim 8, wherein said thermal spreading structures further comprise partial thermal vias passing through said submount from a surface of said submount opposite said LED chip array.

10. The LED package of claim 1, wherein said LED chip array is arranged in two dimensional substantially symmetrical layout.

11. The LED package of claim 10, wherein said LED chips in said LED chip array have a size of greater than approximately 500 microns.

12. The LED package of claim 11, wherein said LED chips have a size of substantially 700 microns.

13. The LED package of claim 1, wherein said substrate comprises ceramic or metal core board.

14. The LED package of claim 13, wherein said ceramic board has high reflectivity.

15. The LED package of claim 1, wherein said submount comprises a polymeric material.

16. The LED package of claim 1, wherein said substrate has a size of substantially 13 mm by 12 mm.

17. The LED package of claim 1, wherein said substrate is substantially planar and further comprises electrical connections on its front or back surface.

18. The LED package of claim 1, wherein said LED chip array comprises LED chips emitting at two colors wherein the ratio between the number of chips emitting at the two colors is greater than or equal to 4 to 1.

19. The LED package of claim 1, wherein said LED chip array comprises LED chips emitting at two colors wherein the ratio between the number of chips emitting at the two colors is greater than or equal to 3 to 1.

20. The LED package of claim 1, wherein the total number of LED chips in said array is 26.

21. The LED package of claim 1, wherein at least some of said LED chips in said LED chip array are connected in series.