Embossing method and apparatus
First Claim
1. A method of embossing a layer of fixable material with a surface profile comprising the steps of;
- a) taking a flexible carrier film having an inverse of the required surface profile formed on one side thereof,b) taking a layer of fixable material located on a substrate that comprises an electrode,c) laminating the carrier film and substrate such the carrier film causes the required surface profile to be formed in the layer of fixable material, andd) fixing the fixable material,wherein the method is performed such that the offset of the surface profile divided by the relative permittivity of the fixable material is less than 1000 nm.
2 Assignments
0 Petitions
Accused Products
Abstract
A method and apparatus for forming a patterned layer having a surface profile that provides relief structures within an electronic device. The method comprises the steps of taking a carrier film (50) having an inverse of the required surface profile formed on one side thereof, taking a layer of fixable material (54) located on a substrate (52), laminating the carrier film (50) and substrate (52) such the carrier film causes the required surface profile to be formed in the layer of fixable material with a predetermined offset, and then fixing the fixable material. Lamination may be performed using rollers (56,58) or a vacuum process. The process is designed to ensure that the offset can be kept as low as possible, preferably to within 150 nm.
59 Citations
41 Claims
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1. A method of embossing a layer of fixable material with a surface profile comprising the steps of;
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a) taking a flexible carrier film having an inverse of the required surface profile formed on one side thereof, b) taking a layer of fixable material located on a substrate that comprises an electrode, c) laminating the carrier film and substrate such the carrier film causes the required surface profile to be formed in the layer of fixable material, and d) fixing the fixable material, wherein the method is performed such that the offset of the surface profile divided by the relative permittivity of the fixable material is less than 1000 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification