MEMS device having a recessed cavity and methods therefor
First Claim
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1. A method of manufacturing a display device, comprising:
- providing a transparent substrate having a microelectromechanical systems device formed thereon;
providing a substantially planar backplate;
applying a first layer around an outer peripheral area of the backplate to form a raised perimeter structure on the backplate;
applying an adhesive second layer over the first layer; and
joining the backplate to the transparent substrate by contacting the second layer to the transparent substrate to form a package after applying the adhesive second layer, wherein the microelectromechanical systems device is encapsulated by the package.
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Abstract
A microelectromechanical systems device having a transparent substrate joined to a planar backplate with a raised perimeter structure forming a recessed cavity or cell. The raised perimeter structure is formed by applying a first layer around the peripheral area of the backplate to form a recessed cell. A second layer is applied over the first layer. The first layer is thicker than the second layer. The thicker layer comprises a viscous material. A second layer is a thinner adhesive layer, and is applied over the thicker layer to join the backplate to the transparent substrate to encapsulate the microelectromechanical systems device formed on the transparent substrate.
161 Citations
23 Claims
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1. A method of manufacturing a display device, comprising:
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providing a transparent substrate having a microelectromechanical systems device formed thereon; providing a substantially planar backplate; applying a first layer around an outer peripheral area of the backplate to form a raised perimeter structure on the backplate; applying an adhesive second layer over the first layer; and joining the backplate to the transparent substrate by contacting the second layer to the transparent substrate to form a package after applying the adhesive second layer, wherein the microelectromechanical systems device is encapsulated by the package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing a display device, comprising:
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providing a substrate, the substrate supporting an array of interferometric modulators; providing a backplate; forming a raised perimeter structure on the backplate; applying an adhesive layer over the raised perimeter structure after forming the raised perimeter structure on the backplate; and sealing the backplate to the transparent substrate via the adhesive layer to form a package, wherein the array of interferometric modulators is encapsulated by the package. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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Specification