Method and apparatus for microjoining dissimilar materials

• US 7,829,363 B2
• Filed: 05/10/2007
• Issued: 11/09/2010
• Est. Priority Date: 05/22/2006
• Status: Expired due to Fees

• Current Assignee: St. Jude Medical Luxembourg Holdings Ii S.A.R.L.
• Original Assignee: CardioMEMS Incorporated
• Inventors: You, Liang
• Primary Examiner(s): Landau; Matthew C
• Assistant Examiner(s): SNOW, COLLEEN ERIN
• Application Number:
  US11/801,586
• Publication Number:
  US 20070269921A1
• Time in Patent Office: 1,279 Days
• Field of Search: 438/50, 438/51, 438/106, 438/121, 438/700, 438/701, 438/702, 257/415, 257/E29.07, 174/354, 174/367, 174/368, 174/390, 174/653, 439/84, 439/346, 439/370
• US Class Current: 438/51
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias

Abstract

Disclosed are apparatus and methods that provide for electrical contacts in a substrate. For example, the apparatus may comprise a trench formed in a substrate, with an electrical contact pad formed on interior walls of the trench that comprises a narrowed opening. A conductive wire is squeezed into the trench that is secured by mechanical stress resulting from material deformation. One exemplary method comprises depositing metal on walls of the trench such that a narrowed opening is provided, and disposing a conductive wire in the trench so that it contacts the deposited metal and is secured by mechanical stress resulting from material deformation. Another exemplary method comprises providing a substrate having a trench formed therein, placing a conductive wire in the trench, and depositing metal atoms into the trench to bury the wire and provide exposed metal on a surface of the substrate.

Claims

1. Apparatus comprising:

a trench formed in a substrate;

an electrical contact pad formed on interior walls of the trench by means for tilting the substrate during deposition to achieve non-uniform deposition such that the trench comprises a narrowed opening; and

a conductive wire squeezed into the trench that is secured by mechanical stress resulting from material deformation.

2. The apparatus recited in claim 1 further comprising:

metal disposed on top of the trench that covers the wire within the trench.

3. A method comprising:

providing a substrate having a trench formed therein;

depositing metal on walls of the trench such that a narrowed opening is provided; and

disposing a conductive wire in the trench so that it contacts the deposited metal and is secured by mechanical stress resulting from material deformation,

wherein deposition comprises tilting the substrate relative to deposition apparatus to achieve non-uniform deposition or to close the trench.

4. The method recited in claim 3 wherein depositing metal comprises:

vapor depositing metal atoms onto walls of the trench using thermal or electron beam apparatus.

5. The method recited in claim 3 further comprising:

sputtering metal atoms to seal the trench.