Method of fabricating a suspension microstructure

  • US 7,829,364 B2
  • Filed: 10/02/2008
  • Issued: 11/09/2010
  • Est. Priority Date: 12/14/2007
  • Status: Active Grant
First Claim
Patent Images

1. A method for fabricating a suspension microstructure comprising the steps of:

  • forming an insulation layer including inner micro-electro-mechanical structures on an upper surface of a silicon substrate, the micro-electro-mechanical structure including at least one microstructure and a plurality of metal circuits that are independent from each other, the micro-electro-mechanical structures having an exposed portion on a surface of the insulation layer, the exposed portion being provided with through holes correspondingly to predetermined etching spaces of the micro-electro-mechanical structures, which only penetrates the insulation layer without contacting the micro-electro-mechanical structures;

    next, forming a photoresist with an opening on the insulation layer, the opening of the photoresist being located outside the through holes of the exposed portion;

    subsequently, conducting an etching from the through holes of the exposed portion downwards to form etching spaces which only penetrate the insulation layer, the microstructures of the micro-electro-mechanical structures being clad in the insulation layer; and

    realizing suspension of the microstructures by etching.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×