Low temperature co-fired ceramics substrate and semiconductor package

  • US 7,829,977 B2
  • Filed: 11/15/2007
  • Issued: 11/09/2010
  • Est. Priority Date: 11/15/2007
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor package, comprising:

  • a substrate unit having a side surface formed with a cutting pattern;

    an electronic unit disposed on a surface of the substrate unit and electrically connected to the substrate unit; and

    an encapsulant disposed on the substrate unit and covering the electronic unit,wherein the cutting pattern has a step-shaped structure with at least two steps.

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