Mechanical isolation for MEMS devices

• US 7,830,003 B2
• Filed: 12/27/2007
• Issued: 11/09/2010
• Est. Priority Date: 12/27/2007
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Jafri, Ijaz, Eskridge, Mark, Foster, Michael, Zhou, Shifang
• Primary Examiner(s): CLARK, SHEILA V
• Application Number:
  US11/965,623
• Publication Number:
  US 20090166827A1
• Time in Patent Office: 1,048 Days
• Field of Search: 257/723, 257/724, 257/414, 257/415, 257/704
• US Class Current: 257/724
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A device according to the present invention includes a MEMS device supported on a first side of a die. A first side of an isolator is attached to the first side of the die. A package is attached to the first side of the isolator, with at least one electrically conductive attachment device attaching the die to the isolator and attaching the isolator to the package. The isolator may include isolation structures and a receptacle.

Claims

1. A device comprising:

a microelectromechanical systems (MEMS) device;

a die configured to support the MEMS device on a first side of the die;

an isolator with a first side attached to the first side of the die;

a package attached to the first side of the isolator,

an electrically conductive attachment device configured to attach the die to the isolator and to attach the isolator to the package; and

a top cover attached to the die, wherein the isolator further includes a receptacle formed through a thickness of the isolator, the receptacle sized and shaped to allow insertion of the top cover through the receptacle.

2. A device comprising:

a microelectromechanical systems (MEMS) device;

a die configured to support the MEMS device on a first side of the die;

an isolator with a first side attached to the first side of the die, wherein the isolator includes isolation structures, and wherein the isolation structures include at least one of tines formed through a thickness of the isolator and shock stops;

a package attached to the first side of the isolator; and

an electrically conductive attachment device configured to attach the die to the isolator and to attach the isolator to the package.

3. A device comprising:

a microelectromechanical systems (MEMS) device;

a die configured to support the MEMS device on a first side of the die;

an isolator with a first side attached to the first side of the die and an angled shelf on the first side of the isolator;

a package attached to the first side of the isolator; and

an electrically conductive attachment device configured to attach the die to the isolator and to attach the isolator to the package.

4. The device of claim 3 wherein when the isolator is attached to the package, a portion of the angled shelf is in contact with the package.