Support structures for free-standing electromechanical devices

• US 7,835,061 B2
• Filed: 06/28/2006
• Issued: 11/16/2010
• Est. Priority Date: 06/28/2006
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Kogut, Lior, Tung, Ming-Hau, Arbuckle, Brian
• Primary Examiner(s): Stultz; Jessica T
• Assistant Examiner(s): Sahle; Mahidere S
• Application Number:
  US11/476,317
• Publication Number:
  US 20080055707A1
• Time in Patent Office: 1,602 Days
• Field of Search: 359/223, 359/224, 359290-292, 359/223.1, 359/224.1, 359/237, 359/245, 359/247, 359/295, 359/298, 345/85, 385/8
• US Class Current: 359/290
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

Claims

1. An electromechanical device comprising:

a functional layer comprising a first material;

a deformable layer comprising a second material different from the first material; and

a connecting element comprising the first material, the connecting element mechanically coupled to the deformable layer and the functional layer, wherein the connecting element and the deformable layer form an interface between the first material and the second material, the interface spaced from the functional layer, wherein the interface is on a side of the deformable layer opposite the functional layer.

2. The device of claim 1, wherein the functional layer has a thickness greater than about 1 micron.

3. The device of claim 1, wherein the functional layer comprises a reflective layer.

4. The device of claim 1, wherein the functional layer comprises a contact layer and wherein the second material is substantially insulating.

5. The device of claim 1, wherein the first material comprises a conductive material.

6. The device of claim 1, wherein the first material comprises aluminum and the second material comprises nickel.

7. The device of claim 1, wherein the connecting element is adhered to the deformable layer.

8. The device of claim 7, wherein the interface has an area between about 80 and 1,440 square microns.

9. The device of claim 7, wherein the interface has an area between about 144 and 512 square microns.

10. The device of claim 1, wherein the connecting element is fused to the deformable layer.

11. The device of claim 1, further comprising:

a display;

a processor that is configured to communicate with said display, said processor being configured to process image data; and

a memory device that is configured to communicate with said processor.

12. The device of claim 11, further comprising a driver circuit configured to send at least one signal to the display.

13. The device of claim 12, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

14. The device of claim 11, further comprising an image source module configured to send said image data to said processor.

15. The device of claim 14, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

16. The device of claim 11, further comprising an input device configured to receive input data and to communicate said input data to said processor.

17. An electromechanical device comprising:

a functional layer comprising a first material;

a deformable layer comprising a second material different from the first material; and

a connecting element comprising the first material, the connecting element mechanically coupled to the deformable layer and the functional layer, wherein the connecting element and the deformable layer form an interface between the first material and the second material, the interface spaced from the functional layer, wherein the interface is on a side of the deformable layer so that the deformable layer is between the interface and the functional layer.

18. The device of claim 17, wherein the functional layer has a thickness greater than about 1 micron.

19. The device of claim 17, wherein the functional layer comprises a reflective layer.

20. The device of claim 17, wherein the functional layer comprises a contact layer and wherein the second material is substantially insulating.

21. The device of claim 17, wherein the first material comprises a conductive material.

22. The device of claim 17, wherein the first material comprises aluminum and the second material comprises nickel.

23. The device of claim 17, wherein the connecting element is fused to the deformable layer.

24. The device of claim 17, wherein the connecting element is adhered to the deformable layer.

25. The device of claim 24, wherein the interface has an area between about 80 and 275 square microns.

32. The device of claim 24, wherein the interface has an area between about 60 and 780 square microns.

26. An electromechanical device comprising:

a functional layer comprising a first material;

a deformable layer comprising a second material different from the first material, the deformable layer electrically connected to the functional layer; and

a connecting element comprising the first material, the connecting element mechanically coupled to the deformable layer and the functional layer, wherein the connecting element and the deformable layer form an interface between the first material and the second material, the interface spaced from the functional layer, wherein the interface is on a side of the deformable layer opposite the functional layer.

27. The device of claim 26, wherein the functional layer has a thickness greater than about 1 micron.

28. The device of claim 26, wherein the functional layer comprises a reflective layer.

29. The device of claim 26, wherein the functional layer comprises a contact layer and wherein the second material is substantially insulating.

30. The device of claim 26, wherein the first material comprises a conductive material.

31. The device of claim 26, wherein the first

33. The device of claim 26, wherein the connecting element is fused to the deformable layer.

34. The device of claim 26, wherein the connecting element is adhered to the deformable layer.

35. The device of claim 34, wherein the interface has an area between about 60 and 780 square microns.

36. The device of claim 34, wherein the interface has an area between about 80 and 275 square microns.