Method for bonding plastic micro chip

  • US 7,842,157 B2
  • Filed: 12/17/2004
  • Issued: 11/30/2010
  • Est. Priority Date: 12/18/2003
  • Status: Active Grant
First Claim
Patent Images

1. A method of bonding an upper substrate and a lower substrate in order to manufacture a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates, the method comprising:

  • (a) forming recesses in each of side lower ends of a bonding region of the upper substrate, wherein the bonding region is a circumference region of the sample filling space; and

    (b) overlapping the upper substrate and the lower substrate each other, and then introducing the organic solvent into the recesses to bond the upper and lower substrates, wherein the recesses are open channels and the organic solvent is introduced into the recesses by capillary phenomenon,wherein the bonding region is bonded by the organic solvent introduced into the recesses.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×