Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device

• US 7,855,449 B2
• Filed: 04/19/2006
• Issued: 12/21/2010
• Est. Priority Date: 04/27/2005
• Status: Expired due to Fees

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Wolf, Ronald Martin, De Graff, Jan, Verschuuren, Marcus Antonius, Kop, Theo Arnold, Nicole, Celine Catherine Sarah, Marra, Johan, Van Sprang, Hans
• Primary Examiner(s): Parekh; Nitin
• Application Number:
  US11/912,751
• Publication Number:
  US 20080191236A1
• Time in Patent Office: 1,707 Days
• Field of Search: 257/707, 257/713, 257/714, 257/81, 257/98, 257/432, 257/433, 257/E23.113
• US Class Current: 257/714
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28F 21/04 of ceramic; of concrete; of natural stone
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integral part of the optical system of the light-emitting semiconductor device (20) and to cool a light-emitting portion (26) of the light-emitting semiconductor device (20). A method of forming a cooling device comprises the steps of forming a charge of ceramic particles, embossing the charge with a stamp to form coolant-conveying channels in the charge, hardening the charge, and providing a cover on top of the channels to seal them.

Claims

1. A cooling device for cooling a light-emitting semiconductor device, the cooling device comprising a ceramic plate having coolant conveying channels incorporated therein, the ceramic plate being adapted for forming an integral part of an optical system of the light-emitting semiconductor device, such that the ceramic plate is at least partially located at a front side of a light-emitting portion of the light-emitting semiconductor device in an optical and thermal contact with the light-emitting portion.

2. A cooling device according to claim 1, wherein the channels are heat pipe channels that contain, sealed in the channels, a liquid.

3. A cooling device according to any one of the preceding claims, wherein the ceramic plate comprises an at least partly translucent ceramic material.

4. A cooling device according to claim 3, wherein the ceramic plate comprises a luminescent material.

5. A cooling device according to claim 1, wherein the ceramic plate is adapted to be glued to the light-emitting portion.