Method and system of attaching a RFID tag to an object

• US 7,859,416 B2
• Filed: 06/21/2007
• Issued: 12/28/2010
• Est. Priority Date: 06/21/2007
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Round Rock Research LLC
• Inventors: Tuttle, John R
• Primary Examiner(s): Lee; Benjamin C
• Assistant Examiner(s): TANG, SIGMUND N
• Application Number:
  US11/766,365
• Publication Number:
  US 20080316035A1
• Time in Patent Office: 1,286 Days
• Field of Search: 3405721-5728, 235/482.02, 235/492, 343/906
• US Class Current: 340/572.8
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

Methods and systems of attaching a RFID tag to an object. At least some of the illustrative embodiments are systems comprising a substrate having a pendant portion and an attachment portion, a radio frequency identification (RFID) circuit disposed on the substrate, and a tag antenna coupled to the RFID circuit and disposed on the substrate. The attachment portion of the substrate is configured to couple to an object and the pendant portion is configured to extend away from the object.

Claims

1. A system comprising:

a substrate comprising a pendant portion and an attachment portion;

a first adhesive layer formed over a first surface of the substrate in the attachment portion;

a second adhesive layer formed over a second surface of the substrate in the pendant portion and in the attachment portion;

an inlay formed on the second adhesive layer and over the pendant portion of the substrate, the inlay comprising a radio frequency identification (RFID) circuit and a tag antenna coupled to the RFID circuit, wherein an end of the second adhesive layer formed in the pendant portion is exposed by the inlay;

a third adhesive layer formed over the inlay; and

a film formed over the pendant portion and over the attachment portion of the substrate, wherein;

in the pendant portion, the film is formed on the third adhesive layer and on the exposed end of the second adhesive layer, and

in the attachment portion, the film is formed on the second adhesive layer,

wherein the first adhesive layer is configured to adhere to an object and fixedly secure the attachment portion of the substrate to the object, and the pendant portion of the substrate is configured to extend away from the object.

2. The system according to claim 1 wherein the RFID circuit and tag antenna are disposed on the inlay over the pendant portion of the substrate.

3. The system according to claim 1 wherein the first adhesive is configured to wrap around a portion of the object and to one or more selected from the group consisting of:

the attachment portion of the substrate and the pendant portion of the substrate.

4. The system according to claim 1 wherein the attachment portion further comprises a fastening system, and wherein the fastening system is configured to couple the attachment portion to the object.

5. The system according to claim 4 wherein the fastening system comprises:

an aperture; and

a notch;

wherein the notch is configured to couple to the aperture to couple the attachment portion to the object.

6. The system according to claim 4 wherein the fastening system comprises one or more selected from the group consisting of:

snap;

staple;

rivet;

grommet;

string; and

cable-tie.