Substrate processing apparatus

• US 7,862,680 B2
• Filed: 05/08/2008
• Issued: 01/04/2011
• Est. Priority Date: 08/02/2001
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Kuroda, Osamu, Nishida, Tatsuya, Orii, Takehiko
• Primary Examiner(s): MACARTHUR, SYLVIA
• Application Number:
  US12/149,829
• Publication Number:
  US 20080210278A1
• Time in Patent Office: 971 Days
• Field of Search: 156/345.21, 156/345.17, 134/198
• US Class Current: 156/345.21
• CPC Class Codes: B08B 3/02 Cleaning by the force of jets or sprays
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles

Abstract

A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

Claims

1. A substrate processing apparatus comprising:

an annular substrate holder configured to hold a substrate, the substrate holder having a circumference;

an annular top plate disposed above the substrate holder, and movable between a first position, where the top plate is located adjacent to an upper surface of the substrate held by the substrate holder, and a second position where the top plate is remote from the upper surface of the substrate held by the substrate holder; and

a chemical liquid nozzle provided to discharge a chemical liquid onto a peripheral portion of the upper surface of the substrate held by the substrate holder; and

wherein the top plate is provided with an inert gas supply path for supplying an inert gas to a space between the top plate and the substrate held by the substrate holder, the inert gas supply path has an open end serving as an inert gas supply port for supplying the inert gas into the space, and the open end is located in a center portion of the top plate so as to face a center portion of the upper surface of the substrate held by the substrate holder when the top plate is in the first position,

wherein the top plate has a circumference sized so as to substantially cover the substrate holder when the top plate is in the first position and,

wherein the top plate has an opening therein for accommodating the chemical liquid nozzle as the nozzle discharges the chemical liquid onto the peripheral portion of the substrate when the top plate is in the first position, and the opening is provided in a peripheral portion of the top plate so that a chemical liquid discharge port of the chemical liquid nozzle accommodated in the opening is located above the peripheral portion of the substrate to face the peripheral portion of the substrate when the top plate is in the first position.

2. The apparatus according to claim 1, wherein the chemical liquid nozzle is movable between a first position adjacent to the peripheral portion of the upper surface of the substrate held by the substrate holder, and a second position where the chemical liquid nozzle is withdrawn from a space above the upper surface of the substrate held by the substrate holder, the chemical liquid nozzle being in its first position when the top plate is in its first position, and the chemical liquid nozzle being in its second position when the top plate is in its second position.

3. The apparatus according to claim 1, further comprising an enclosure structure defining therein a closed space accommodating the chemical liquid nozzle and the top plate.

4. The apparatus according to claim 3, wherein an opening allowing the substrate to be loaded into and unloaded from the closed space defined in the enclosure structure is provided on the enclosure structure, and wherein a shutter for closing the opening is provided at the opening.

5. The apparatus according to claim 3, further comprising a N₂ gas supplier that supplies N₂ gas from an upper portion of the enclosure structure into the closed space.

6. The apparatus according to claim 1, further comprising a pure water nozzle that positions, as viewed from above, nearer to a center of the substrate held by the substrate holder than the chemical liquid nozzle, to supply pure water onto the upper surface of the substrate.

7. The apparatus according to claim 6, wherein the chemical liquid nozzle is inclined such that the chemical liquid jetted from the chemical liquid nozzle is directed toward outside the substrate held by the substrate holder.

8. The apparatus according to claim 6, further comprising an inert gas nozzle that positions, as viewed from above, nearer to a center of the substrate held by the substrate holder than the pure water nozzle, to supply inert gas onto the upper surface of the substrate.

9. The apparatus according to claim 1, further comprising a spin chuck having a chuck body and a plurality of holding members arranged at angular intervals which hold the peripheral part of the substrate.