Method for manufacturing a probe

• US 7,862,733 B2
• Filed: 12/19/2007
• Issued: 01/04/2011
• Est. Priority Date: 01/05/2007
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Nihon Micronics
• Original Assignee: Kabushiki Kaisha Nihon Micronics
• Inventors: Soma, Akira, Hamada, Kazuhito, Hayashizaki, Takayuki, Hirakawa, Hideki
• Primary Examiner(s): OLSEN, ALLAN W
• Application Number:
  US11/960,502
• Publication Number:
  US 20080210663A1
• Time in Patent Office: 1,112 Days
• Field of Search: None
• US Class Current: 216/11
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: C23F 1/10 Etching compositions C23F1/44 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily. A sacrificial layer is formed on a base table. The sacrificial layer is partially removed so as to form a recess in the sacrificial layer. A mask that exposes an area formed in a desired probe flat surface shape containing the recess is formed on the sacrificial layer. A probe material exhibiting different etching resistance characteristics from those of the sacrificial layer is deposited in the area exposed from the mask. By the deposition of the material, a coupling portion corresponding to the recess and a probe that is integral with the coupling portion are formed. After the mask is removed, the sacrificial layer is removed with use of etchant. Thereafter, the probe held on the base table at the coupling portion is detached from the base table together with the coupling portion.

Claims

1. A probe manufacturing method comprising the steps of:

forming a sacrificial layer on a base table;

partially removing said sacrificial layer so as to form a recess in said sacrificial layer;

forming on said sacrificial layer a mask that exposes an area formed in a desired probe flat surface shape containing said recess on said sacrificial layer;

depositing in said area exposed from said mask a probe material exhibiting different etching resistance characteristics from those of said sacrificial layer to form a coupling portion corresponding to said recess and a probe that is integral with said coupling portion;

after removing said mask, removing said sacrificial layer with use of etchant against which said probe material exhibits more excellent etching resistance characteristics than said sacrificial layer does; and

detaching from said base table said probe held on said base table at said coupling portion together with said coupling portion.

2. The probe manufacturing method according to claim 1, wherein, prior to formation of said sacrificial layer on said base table, an adhesive layer that promotes growth of said sacrificial layer is formed on said base table, and said recess formed in said sacrificial layer exposes said adhesive layer at the bottom of said recess.

3. The probe manufacturing method according to claim 2, wherein said coupling portion is supported on said base table via said adhesive layer exposed on the bottom of said recess.

4. The probe manufacturing method according to claim 1, wherein said mask is formed by selective exposure and development of a photomask layer made of a photomask material.

5. The probe manufacturing method according to claim 1, wherein said probe material is nickel or nickel alloy, said sacrificial layer is copper, and said etchant is one consisting primarily of tetra amine copper chloride.

6. The probe manufacturing method according to claim 1, wherein said probe is an entirely plate-shaped probe comprising an attachment portion having an attachment end to a probe substrate, an arm portion extending in a lateral direction from said attachment portion, and a probe tip portion extending to an opposite side of a side where said attachment end of said attachment portion is located and provided with a probe tip at its tip end.

7. The probe manufacturing method according to claim 6, wherein said coupling portion is a first stem portion formed at a part corresponding to said attachment portion of said probe.

8. The probe manufacturing method according to claim 7, wherein a second stem portion is further formed at a part corresponding to said probe tip portion of said probe, and the flat surface shape of said stem portion is smaller than the flat surface shape of said first stem portion formed at a part corresponding to said attachment portion.

9. The probe manufacturing method according to claim 8, wherein, after the etching process removing said sacrificial layer by said etchant, said probe material undergoes heat treatment in a state where said probe is supported on said base table at two points by said both stem portions.

10. The probe manufacturing method according to claim 9, wherein, after said heat treatment, said second stem portion is removed by an etching process, and said probe held on said base table at the remaining first stem portion is detached from said base table.