Method of flatting evaporating section of heat pipe embedded in heat dissipation device

• US 7,866,043 B2
• Filed: 04/28/2008
• Issued: 01/11/2011
• Est. Priority Date: 04/28/2008
• Status: Expired due to Fees

• Current Assignee: CPUMate Incorporated, Golden Sun News Techniques Company Limited
• Original Assignee: CPUMate Incorporated, Golden Sun News Techniques Company Limited
• Inventors: Hsu, Ken, Cheng, Chih-Hung, Lin, Kuo-Len, Liu, Wen-Jung
• Primary Examiner(s): Ford; John K
• Application Number:
  US12/110,438
• Publication Number:
  US 20090266522A1
• Time in Patent Office: 988 Days
• Field of Search: 165/80.4, 165/104.26, 165/104.33, 165/80.3, 165/185, 361/700, 361/704, 257/715, 257/722, 298/900.32
• US Class Current: 29/890.032
• CPC Class Codes: B21D 53/02 heat exchangers or parts thereof, e.g. radiators, condensers fins, headersmaking finned or ribbed tubes by fixing strip material or the like to tubes B21C37/22
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2013/006 Heat conductive materials
• CPC Class Codes: F28F 2275/12 by methods involving deformation of the elements
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

Claims

1. A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device, the method comprising the following steps:

providing at least a heat pipe and a base and a plurality of fins of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for the heat pipe being embedded therein;

positioning an evaporating section of the heat pipe on the groove of the base and engaging a condensing section of the heat pipe with the fins;

pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base;

flatting the protruded uneven surface of the evaporating section of the heat pipe by polishing performed with a polishing device including a working station, a fixing board, and a flatting unit, the working station defining a sliding groove configured for sliding the fixing board into the working station therefrom, the fixing board defining a receiving groove and a concave being defined in the receiving groove configured for fixing the base of the heat dissipation device, which further includes the steps of;

positioning the base of the heat dissipation device on the concave via the receiving groove of the fixing board; and

sliding the fixing board with base of the heat dissipation device fixed thereon into the working station via the sliding groove for making the protruded uneven surface of the evaporating section of the heat pipe facing the flatting unit.

2. The method of claim 1, further comprising coating a heat conductive medium on the inner wall of the groove of the base before positioning the evaporating section of the heat pipe on the groove of the base.

3. The method of claim 2, wherein the heat conductive medium is heat conductive paste.

4. The method of claim 1, wherein a supporting surface is defined in the sliding groove which leans against a bottom surface of the fixing board for sliding the fixing board into the working station gradually from a wide side to a narrow side.