System and method for CMOS image sensing
First Claim
1. A CMOS image sensing pixel comprising:
- an n-type substrate, the n-type substrate including a first width and a first thickness;
a p-type epitaxy layer overlying the n-type substrate, the p-type epitaxy layer including a second width and a second thickness, the second width including an adjustable depletion region between the n-type substrate and the p-type epitaxy layer, the adjustable depletion region being associated with one or more characteristics of a colored light;
an n-type layer overlying the p-type epitaxy layer, the n-type layer being associated with a third width and a third thickness;
a pn junction formed between the p-type epitaxy layer and the n-type layer; and
a control circuit being coupled to the CMOS image sensing pixel.
1 Assignment
0 Petitions
Accused Products
Abstract
A system and method for sensing image on CMOS. According to an embodiment, the present invention provide a CMOS image sensing pixel. The pixel includes an n-type substrate, which includes a first width and a first thickness. The pixel also includes a p-type epitaxy layer overlying the n-type substrate. The p-type epitaxy layer includes a second width and a second thickness. The second width is associated with one or more characteristics of a colored light. The pixel additionally includes an n-type layer overlying the p-type epitaxy layer. The n-type layer is associated with a third width and a third thickness. Additionally, the pixel includes an pn junction formed between the p-type epitaxy layer and the n-type layer. Moreover, the pixel includes a control circuit being coupled to the CMOS image sensing pixel.
45 Citations
19 Claims
-
1. A CMOS image sensing pixel comprising:
-
an n-type substrate, the n-type substrate including a first width and a first thickness; a p-type epitaxy layer overlying the n-type substrate, the p-type epitaxy layer including a second width and a second thickness, the second width including an adjustable depletion region between the n-type substrate and the p-type epitaxy layer, the adjustable depletion region being associated with one or more characteristics of a colored light; an n-type layer overlying the p-type epitaxy layer, the n-type layer being associated with a third width and a third thickness; a pn junction formed between the p-type epitaxy layer and the n-type layer; and a control circuit being coupled to the CMOS image sensing pixel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An image sensing pixel, comprising:
-
an n-type silicon substrate, the n-type semiconductor substrate including a first width; a p-type silicon layer overlying the n-type substrate, the p-type silicon layer including a second width; an n-type silicon layer overlying the p-type silicon layer, the n-type silicon layer being associated with a third width; a pn junction formed between the p-type silicon layer and the n-type silicon layer; and a silicon germanium layer in the p-type silicon layer, the silicon germanium layer being positioned away from the pn junction. - View Dependent Claims (13, 14)
-
-
15. An image sensing pixel device, comprising:
-
a first photodiode having a first p-type region and a first n-type region forming a first pn junction overlying a first n-type substrate; a second photodiode having a second p-type region and a second n-type region forming a second pn junction overlying a second n-type substrate; a third photodiode having a third p-type region and a third n-type region forming a third pn junction overlying a third n-type substrate; a terminal coupled to the first n-type region, the second n-type region, and the third n-type region; a first bias voltage coupled to the first n-type substrate; a second bias voltage coupled to the second n-type substrate; and a third bias voltage coupled to the third n-type substrate. - View Dependent Claims (16, 17, 18, 19)
-
Specification