Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

  • US 7,868,465 B2
  • Filed: 06/04/2007
  • Issued: 01/11/2011
  • Est. Priority Date: 06/04/2007
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a carrier having a top main surface;

    an electrically insulating layer having a top main surface and a bottom main surface applied onto the carrier such that the bottom main surface of the electrically insulating layer faces the top main surface of the carrier;

    an adhesive layer having a top main surface and a bottom main surface applied to the electrically insulating layer such that the bottom main surface of the adhesive layer faces the top main surface of the electrically insulating layer;

    a first semiconductor chip applied to the adhesive layer; and

    a second semiconductor chip directly applied to the carrier and which is electrically connected to the carrier, wherein the second semiconductor chip is not covered by the electrically insulating layer.

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